Industrial Computing

Fanless Computers

FANLESS COMPUTERS

Passive Heat Management for Rugged Configurations

The advent of the fanless industrial computer ignited a revolution that persists to this day. Previously, the heat management of a computer's CPU and other components relied solely on fans. This introduced dust, dirt, and debris while constraining the environments in which PCs could operate, ultimately limiting their lifespan.

The fanless PC has transcended its initial role in factory settings thanks to its enhanced reliability, versatility, and design adaptability. This innovation has opened a world of possibilities, extending its reach to various applications and environments. Engineers, designers, and users are no longer bound by the limitations of traditional computing solutions. They now have the freedom to deploy computational power wherever they desire.

Contact us today to find the right fanless solution to fit your needs.


Fanless Heat Management

In fanless configurations, heat dissipation relies on direct contact between the CPU and a metal plate facilitated by a conductive paste layer. This plate acts as a conduit for passive heat transfer from components such as memory modules. Through convection, fins on the plate efficiently disperse warm air away from the system, ensuring optimal thermal performance without needing a fan.

Superior Design Solution

The fanless design is a natural choice for rugged applications due to its absence of moving parts. This design ensures superior equipment performance and longevity by eliminating the necessity for circulating dusty, dirty, or damp air over electrical components. Moreover, eliminating bulky fans results in a significantly higher compute power density per cubic inch than traditional industrial equipment.

Variety of Configurations

It might seem contradictory, but a fanless computer can incorporate a fan. A GPU computer is a good example. A fan using external air cools the GPU and related components, and the compute elements are housed in a separate fanless compartment. This innovative setup allows for adding various components in separate sections (cassettes), making the fanless platform both functional and highly flexible.


Fanless Computers

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  1. In-vehicle compact computer with Intel E3950 Apollo Lake processor

    POC-351VTC Intel E3950 Apollo Lake ultra-compact fanless in-vehicle gateway

    POC-351 VTC

    Main Features:

    • Intel® Apollo Lake Atom™ E3950 quad-core processor
    • Rugged, -25 °C to 70 °C fanless operation
    • Two IEEE 803.3at PoE+ ports and one GbE port
    • One isolated CAN port for in-vehicle communication
    • One M.2 socket and three mini-PCIe sockets
    • Aluminum heat-spreader for M.2/ mPCIe modules
    • 4-CH isolated DI and 4-CH isolated DO
    • 8~35V DC input with built-in ignition power control

     

    Learn More
    PDF Document - POC-351VTC Data Sheet
    POC-351VTC Data Sheet
    (Size: 2.2 MB)
    PDF Document - POC-351VTC User Manual
    POC-351VTC User Manual
    (Size: 12.3 MB)
    PDF Document - MezIO Compatibility Chart
    MezIO Compatibility Chart
    (Size: 791.1 KB)

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