Neousys

• Universal standalone power backup module compatible with all box-PCs
• Supercapacitor-based, -25°C to 65°C wide temperature operation
• 4600 watt-second energy capacity
• Maximum 180W output power for the connected back-end system
• Over 10 years lifespan, and 500,000 charging / discharging cycles
• Patented CAP energy management technology
• Extends back-up time in the event of an unforeseen power outage
• Monitoring energy and power consumption to extend operation time for safe system shutdown
• Versatile operating modes
  • Normal backup mode
  • Ignition control mode for standard box-PC and in-vehicle controllers
• EN50155 certificate

Main Features

• Compliant with IEEE 802.3bt PoE++ PSE, provides up to 90W on a single port
• 4x IEEE 802.3bz 2.5GBASE-T Ethernet ports by Intel® I225-IT controller
• Supports 2.5G/ 1G/ 100M/ 10M link speed
• Available in RJ-45 (PCIe-PoE425bt) and M12 (PCIe-PoE425M) connectors
• x4, Gen2 PCI Express interface
• Supports 9.5 kB jumbo frame, teaming and IEEE 1588
• Per-port PoE+ power on/ off control by software API

Due to global chip shortages, this product temporarily available only with a system sale.

• Powered by NVIDIA Jetson AGX Xavier SOM bundled with JetPack 4.4
• 4x IEEE 802.3at Gigabit PoE+ ports with screw lock
• 2x front-accessible, hot swappable 2.5" HDD/SSD trays
• 1x mini-PCIe socket for WiFi/4G module
• 1x isolated CAN bus port and 1x RS-232 port with flow control
• 1x GPS PPS input, 3-CH isolated DI and 4-CH isolated DO
• 8~35V wide-range DC input with built-in ignition power control

Main Features:

• Supports 250W NVIDIA® graphics card up to 14 TFLOPS in FP32
• Supports Intel® Xeon® E or 8th/ 9th-Gen Core™ i7/ i5 LGA1151 CPU
• Up to 128GB ECC/ non-ECC DDR4 2133 (4x SODIMM)
• One x 16 (8-lanes), two x 8 (4-lanes), Gen3 PCIe slots for add-on cards
• 2 x M.2 B key and 3 x full-size mini-PCIe sockets
• 8~35V wide-range DC input with built-in ignition power control
• Patented thermal design for -25°C to 60°C rugged operation
• Patented damping brackets to withstand 1 Grms vibration

• AMD Ryzen™ embedded V1000 series quad-core 15W/ 45W CPU
• -25°C to 70°C rugged wide-temperature operation
• Four Gigabit PoE+ ports with screw-lock
• Four USB 3.0 ports with screw-lock
• M.2 2280 M key NVMe (Gen3 x2) socket for fast storage access
• DP + VGA dual display outputs
• Front I/O access and DIN-rail mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Fanless and rugged, wide temperature operation (-25°C to 70°C)
• One GbE port and two Gigabit PoE+ ports
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

For your convenience, the following part numbers can be used when a POC-300 is combined with a MezIO. Order below or select the part number and go to the product page.

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Rugged, -25 °C to 70 °C fanless operation
• Two IEEE 803.3at PoE+ ports and one GbE port
• One isolated CAN port for in-vehicle communication
• One M.2 socket and three mini-PCIe sockets
• Aluminum heat-spreader for M.2/ mPCIe modules
• 4-CH isolated DI and 4-CH isolated DO
• 8~35V DC input with built-in ignition power control

Main Features:

• Ultra-compact 150 mm x 100 mm foot-print
• Intel Atom E3845 1.91GHz Quad-core processor
• Rugged, -20 C° to 70 C° fanless operation
• Two 802.3at (25.5W) Gigabit PoE ports
• Three USB 3.0 ports
• Standard 2.5 inch SATA HDD/SSD accommodation
• Up to two RS-232/422/485 ports and two RS-232 ports

• Intel® 8th-Gen Coffee Lake Core™ i hexa-core 35W/65W LGA1151 CPU
• Patented Cassette for PCI/PCIe add-on card accommodation
• MezIO™ interface for easy function expansion
• Rugged, -25°C to 70°C fanless operation
• Up to 6x GigE ports, supporting 9.5KB jumbo frame
• Up to 64 GB, DDR4-2666 SODIMM
• 4x USB 3.1 Gen2 ports and 4x USB 3.1 Gen1 ports
• VGA/DVI/DP triple independent display, supporting 4K2K resolution
• Includes an E Riser Card

• Intel® 8th-Gen Coffee Lake Core™ i hexa-core 35W/65W LGA1151 CPU
• Patented Cassette for PCI/PCIe add-on card accommodation
• MezIO™ interface for easy function expansion
• Rugged, -25°C to 70°C fanless operation
• Up to 6x GigE ports, supporting 9.5KB jumbo frame
• Up to 32 GB, DDR4-2666 SODIMM
• 4x USB 3.1 Gen2 ports and 4x USB 3.1 Gen1 ports
• VGA/DVI/DP triple independent display, supporting 4K2K resolution
• Includes an E Riser Card

• Intel® 8th-Gen Coffee Lake Core™ i hexa-core 35W/65W LGA1151 CPU
• Patented MezIO™ expansion interface
• Patented Cassette for PCI/PCIe add-on card accommodation (EP systems)
• Rugged, -25°C to 70°C fanless operation
• Up to 64GB DDR4-2666/2400 SDRAM (2 slots)
• 6x GbE ports (PoE+ ports 3~6)
• 4x USB3.1 Gen. 2/4x USB3.0 Gen. 1
• K2K resolution, VGA/DVI/DP triple independent display support

Main Features:

• Supports Intel® 9th / 8th Core™ i7/ i5/ i3 LGA1151 socket-type CPU
• 4x or 8x 802.3at Gigabit PoE+ ports via M12 or RJ45 connectors
• Onboard isolated CAN bus for in-vehicle communication
• 4-CH isolated DI and 4-CH isolated DO
• 2x hot-swappable SATA HDD trays, supporting RAID 0/1
• 2x M.2 B key and 3x full-size mini-PCIe sockets
• 8~35V wide-range DC input with built-in ignition power control
• Patented Cassette for PCIe add-on card accommodation*
• E-Mark and EN 50155 certificate

Main Features:

• Supports dual 250W NVIDIA® graphics cards up to 28 TFLOPS in FP32
• Supports Intel® Xeon® E or 8th-Gen Core™ i7/i5 LGA1151 CPU
• Up to 128GB ECC/non-ECC DDR4 2133 (4x SODIMM)
• Two x8, one x4, Gen3 PCIe slots for add-on cards
• Two hot-swappable 2.5” SATA HDD/ SSD with RAID 0/ 1 support
• 8~35V wide-range DC input with built-in ignition power control
• Patented thermal design for -25°C to 60°C rugged operation
• Patented damping brackets to withstand 1 Grms vibration

• Intel Xeon E or 9th/8th-Gen Core i7/i5/i3 Cpu
• 2U half rack fanless system, -40 to 70C operation
• 4x 802.3at gigabit PoE, VGA, 2x USB 2.0, 2x COM via M12 connectors
• M.2 B key for 4G/5G module, M.2 E key for WiFi module
• Patented superecapacitor based uninterruptible power backup (SEMIL-1311J)
• 8-48V wide range DC input with built in ignition power control
• CE, FCC, and EN 50155 certified

• Fanless GPU computer with NVIDIA Tesla T4 or Quadro P2200 Graphics Card
• Guaranteed non-throttleing GPU performance up to 62C ambient
• Intel Xeon E or 9th/8th-Gen Core i7/i5/i3 Cpu
• 2U 19"chassis for rack or wall mount
• 4x 802.3at gigabit PoE via M12 A-coded connectors
• 1 DisplayPort and 3x USB 3.1 Gen1 ports
• 8-48V wide range DC input with built in ignition power control
• CE, FCC, and EN 50155 certified

• Fanless GPU computer with NVIDIA Tesla T4 or Quadro P2200
• Guaranteed non-throttling GPU performance up to 62C ambient
• Intel Xeon E or 9th/8th-Gen Core i7/i5/i3 Cpu
• 2U 19"chassis for rack or wall mount
• 4x 802.3at gigabit PoE via M12 A-coded connectors
• 1 DisplayPort and 3x USB 3.1 Gen1 ports
• 8-48V wide range DC input with built in ignition power control
• CE, FCC, and EN 50155 certified

• Intel Xeon E or 9th/8th-Gen Core i7/i5/i3 Cpu
• Extrememly rugged IP67 rated waterproof and dustproof
• -40-70C wide tempurature fanless operation
• 2U 19" half rack form factor for rack or wall mount
• Up to 8x 802.3at gigabit PoE+ ports via M12 connectors
• VGA, USB 2.0 and COM ports via M12 A coded connectors
• Patented superecapacitor based uninterruptible power backup (SEMIL-1714J and 1718J)
• 8-48V wide range DC input with built in ignition power control
• MIL-STD-810G and EN 50115 certified

‧ Intel® Elkhart Lake Atom® x6211E dual-core processor
‧ 49 x 89 x 112 mm extremely compact form factor
‧ Rugged -25°C to 70°C fanless wide-temperature operation
‧ Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
‧ M.2 2280 M key SATA storage interface
‧ One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
‧ One M.2 E key socket for WiFi 5/ WiFi 6 modules
‧ One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

• Intel® Elkhart Lake Atom® x6425E quad-core 1.8GHz/ 3.0GHz 12W processor
• Rugged -25 °C to 70 °C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
• 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
• M.2 2280 M key SATA interface
• Dual DP display outputs supporting 4096 x 2160 resolution
• Front I/O access DIN-mounting design
• MezIO™ compatible

• AMD Ryzen embedded V1807B quad-core 45W CPU
• Integrated Vision Specific I/O
  • 4-CH CC/CV lighting controller
  • 4-CH camera trigger outputs
  • 1-CH quadrature encoder input
  • 8-CH isolated DI and 8-CH isolated DO
• Patented MCU-based, real time I/O control by DTIO V2 and NuMCU
• Built-in camera interfaces
  • Four Gigabit PoE+ ports with screw-lock
  • Four USB 3.1 ports with screw-lock
• M.2 2280 M key NVMe (Gen3x2) socket for fast storage access

• Powered by NVIDIA Jetson AGX Xavier SOM bundled with JetPack 4.4
• Support 8x GMSL automotive cameras via FAKRA Z connectors
• 1x 10 GBASE-T 10G Ethernet port
• 1x M.2 2280 M key socket for NVMe SSD
• 1x miniPCIe socket for WiFi/4G module
• 1x Isolated CAN bus port and 1x RS-232 port with flow control
• 1x GPS PPS input, 3-CH isolated DI and 4-CH isolated DO
• 8V to 35V wide-range DC imnput with built-in ignition power control

• Constant current LED lighting control
• 4-CH/2-CH LED Outputs
• Up to 2A continuous output, max 180W rated
• Up to 10A overriding output, max 500W peak
• 4-CH/2-CH isolated trigger inputs
• Support versatile operating modes:
• continuous, pulsed, overdriving, and switched
• Support RS-232 and Ethernet interface
• 12-35V wide range DC input

Main Features:

• 212 x 165 x 63 mm low-profile design
• Intel 9th/8th Gen Core 35W LGA1151 CPU
• Rugged, -25C to 60C fanless operation
• 4x GbE and 4x USB 3.1Gen1 with screw lock
• 1 hot swappable HDD/SSD tray and 1x M.2 2280 socket for storage
• 4-CH isolated DI and 4-CH isolated DO
• DVI-I + DP dual display outputs
• Optional ignition power control