Industrial Computing
Fanless Computers
FANLESS COMPUTERS
Rugged, Expandable, Passive Heat Management
The advent of the fanless industrial computer ignited a revolution that persists to this day. Previously, the heat management of a computer's CPU and other components relied solely on fans. This introduced dust, dirt, and debris while constraining the environments in which PCs could operate, ultimately limiting their lifespan.
The fanless PC has transcended its initial role in factory settings thanks to its enhanced reliability, versatility, and design adaptability. This innovation has opened a world of possibilities, extending its reach to various applications and environments. Engineers, designers, and users are no longer bound by the limitations of traditional computing solutions. They now have the freedom to deploy computational power wherever they desire.
Contact us today to find the right fanless solution to fit your needs.
Fanless Heat Management
In fanless configurations, heat dissipation relies on direct contact between the CPU and a metal plate facilitated by a conductive paste layer. This plate acts as a conduit for passive heat transfer from components such as memory modules. Through convection, fins on the plate efficiently disperse warm air away from the system, ensuring optimal thermal performance without needing a fan.
Superior Design Solution
The fanless design is a natural choice for rugged applications due to its absence of moving parts. This design ensures superior equipment performance and longevity by eliminating the necessity for circulating dusty, dirty, or damp air over electrical components. Moreover, eliminating bulky fans results in a significantly higher compute power density per cubic inch than traditional industrial equipment.
Variety of Configurations
It might seem contradictory, but a fanless computer can incorporate a fan. A GPU computer is a good example. A fan using external air cools the GPU and related components, and the compute elements are housed in a separate fanless compartment. This innovative setup allows for adding various components in separate sections (cassettes), making the fanless platform both functional and highly flexible.
Fanless Computers
POC-700: Intel Core i3-N305/Atom x7425E Ultra-Compact Embedded Computer with 4x PoE+, USB 3.2, and MezIO Interface
POC-700- Intel Alder Lake Core i3-N305 processor 15W with 8 E-Cores or Atom x7425E
- Up to 16GB DDR5-4800 SODIMM
- -25 °C to 70 °C rugged wide temperature operation
- 4x GbE ports PoE+ / 4x USB3.2 Gen 2 with screw-lock
- M.2 2280 M key SATA socket
- DP++ / HDMI 1.4b dual display outputs
- 4-CH isolated DI + 4-CH isolated DO
- Front I/O access DIN-mounting design
- MezIO compatible
- UL certification (UL-US-2409582-0)
- Complies with UL 62368-1 standards
Starting at $775.00
Nuvo-9531: Intel 13th-Gen Compact Fanless Computer with 4x 2.5GbE, 4x USB3.2, and 1x Hot-Swappable HDD Tray
Nuvo-9531 Series- 212 x 165 x 63 mm low-profile design
- Intel 13th-Gen Core™ 35W/65W LGA1700 CPU
- Rugged, -25°C to 60°C fanless operation
- 4x GbE and 4x USB3.2 Gen 1 with screw-lock
- 1x hot-swappable HDD tray and 1x M.2 2280 Gen4 x4 NVMe
- 2x full-size mPCIe sockets
- 4-CH isolated DI and 4-CH isolated DO
- VGA + DP dual display outputs
Starting at $1,300.00
Nuvo-9531-FT: Intel 13th-Gen Compact Fanless Computer with 4x 2.5GbE, 4x USB3.2, and 1x Hot-Swappable HDD Tray and Flattop Heatsink
Nuvo-9531-FT Series- 212 x 165 x 45 mm low-profile design with flattop heatsink
- Intel 13th-Gen Core 65W/35W LGA1700 CPU
- Rugged, -25°C to 60°C fanless operation
- 4x 2.5GbE with optional PoE+ and 4x USB3.2 Gen 1 with screw-lock
- 1x M.2 2280 Gen4 x4 NVMe and 1x hot-swappable HDD tray for storage
- 4-CH isolated DI and 4-CH isolated DO
- VGA + DP dual display output
- Optional ignition power control
Starting at $1,355.00