FLYC-300 Series: Neousys Lightweight Jetson Orin NX Computer
FLYC-300 SeriesStarting at $1,440.00
- Low size, weight, and power (SWaP) at only 297g
- Up to 100 TOPS GPU by NVIDIA Jetson Orin NX
- Supports multiple camera and sensor interfaces
- 2x GbE and 2x USB3 for RGB/ Infrared/hyperspectral cameras and lidar/radar
- 2x GMSL2 for HDR/ 3D cameras
- Built-in UART and CAN to interact with the flight controller
- 1x M.2 2230 for storage and 4G/5G communication ready
- Supports 4S-14S drone battery pack
Frequently Asked Questions
The FLYC-300 provides the following external I/O:
- 1x Gigabit Ethernet port (via NVIDIA SoM)
- 1x 2.5Gb Ethernet port (Intel® I226-IT/I225-IT)
- 1x USB 3.2 Gen2 (10Gbps) Type A port
- 1x USB 3.2 Gen1 (5Gbps) Type A port
- 1x USB Type-C port (reserved for original manufacturing purposes)
- 2x GMSL2 FAKRA Z connectors for camera input
- 1x DisplayPort
- 1x microSD card slot
Internally, it also offers 1x USB 2.0, 1x CAN bus 2.0, I2C, isolated 2x DI/4x DO, and 1x UART.
The FLYC-300 has two FAKRA Z connectors supporting GMSL2 cameras, capable of 2x 1920x1080 @ 60 FPS or 1x 2880x1860 @ 30 FPS camera input. These are intended for automotive-grade GMSL2 cameras (IP67 waterproof, 120dB HDR, auto white balance, LED flicker mitigation) as well as 3D cameras for depth mapping in applications like surveying, inspection, and navigation.
The FLYC-300 uses an XT-30 DC input connector supporting 12V to 60V DC, compatible with 4S to 14S drone battery packs. Note the polarity of the XT-30 connector must be observed. A 20cm XT-30 power cable is included with the system.
The FLYC-300 supports three operating temperature configurations:
- -25°C to 40°C: no heat spreader attachment required, compatible with 4S-14S battery packs
- -25°C to 60°C: heat spreader attachment required (secured to a metallic surface via conduction), compatible with 4S-14S battery packs
- -25°C to 70°C: heat spreader attachment required, compatible with 4S-6S battery packs only
Storage temperature range is -40°C to 85°C. For sub-zero operating temperatures, a wide temperature SSD is required.
The FLYC-300 meets EN62368-1 safety standards and CE/FCC Class A EMC compliance according to EN 55032 & EN 55035. It is also tested to MIL-STD-810H for vibration (Method 514.8, Category 4) and shock (Method 516.8, Procedure I).
The FLYC-300 comes with 8GB or 16GB LPDDR5 memory (@ 3200 MHz) on the NVIDIA Jetson Orin NX SOM, depending on model. For storage, it has one M.2 2230 M key socket supporting NVMe (Gen4 x4 per the datasheet, listed as Gen3 x1 in the user manual). It also includes a microSD card slot.
Yes. The FLYC-300 has one M.2 3042/3052 B key socket with an internal micro SIM socket, supporting 5G/4G modules. SMA antenna apertures are located on the side panels for the wireless module's antennas.
The FLYC-300 supports wall mounting. It can be secured using the four M4 threads on the flattop heatsink, either inside or outside of an enclosure panel. An optional 90x90x0.5mm thermal pad is available for mounting.
FLYC-300-EC includes an enclosure while FLYC-300 does not. With the enclosure, dimensions are 124mm x 123mm x 30.5mm and weight is 345g. Without the enclosure, dimensions are 124mm x 123mm x 29.8mm and weight is 297g.
The FLYC-300 is shipped with JetPack 5.x installed as a turnkey solution. If needed, it can be reflashed using a pre-built system image from Neousys via a Host Machine connected through a microUSB to USB Type A cable.
How-to Guides
- Disassemble the system to gain access to internal components (remove enclosure screws, front panel, top panel, heat spreader, and copper stands as needed).
- Insert the M.2 2230 M key NVMe SSD module at a 45 degree angle into the slot.
- Press the SSD down and secure it with a screw.
- Remove the corresponding thermal pad protective film on the enclosure.
- Reinstall the enclosure.
- Disassemble the system to gain access to internal components.
- Insert the M.2 3042/3052 B key module at a 45 degree angle into the slot.
- Secure the module with a screw.
- Locate the SIM card slot on the other side of the motherboard. Push the SIM slot holder in the indicated direction and flip open the holder to place the SIM into the slot.
- Remove the corresponding thermal pad protective film on the enclosure (or remove the thermal pad entirely if installing the SparkLAN WNFQ-262ACNI(BT) module, due to its thickness).
- Reinstall the enclosure.
- Confirm the polarity of the XT-30 connector before connecting.
- Use the included 20cm XT-30 power cable to connect a compatible 4S-14S drone battery pack (12V to 60V DC) to the XT-30 DC input connector.
- Locate the four M4 threads on the flattop heatsink.
- To mount inside an enclosure, align the screw holes with the panel and secure using the four M4 threads.
- To mount outside an enclosure, match the four M4 threads to the panel and secure the system to the outside of the panel.
- Optionally, attach a 90x90x0.5mm thermal pad by aligning it with the indicated corners before mounting.
- Remove the punch-out panel for the fan's 3-pin cable.
- Position the fan at the bottom of the enclosure, aligning the base mount with the screw threads (rotate the fan blades manually if needed to access screw holes).
- Plug the fan's 3-pin cable into the removed punch-out panel opening.
- Secure the fan enclosure with the indicated screws and adjust cable slack as necessary.
Neousys FLYC-300 is an NVIDIA Jetson Orin NX mission computer tailor-made for UAV and UGV applications. Designed to coincide and collaborate with the flight controller responsible for stabilizing and controlling the drone’s flight, FLYC-300 fuels compelling 100 TOPS AI performance. It combines versatile sensors to empower drones' true autonomy and advance applications such as autonomous navigation, obstacle avoidance, object detection, and tracking.
Catering to the diverse needs of cameras and sensors like RGB, hyperspectral, infrared, LiDAR, and 3D cameras, FLYC-300 boasts a versatile array of connectivity options, including two Ethernet, two USB3.2, and two GMSL2 ports. Making it ideal for real-time video analytics applications such as drone imagery collection, environmental monitoring, and infrastructure monitoring. To command the flight of a drone, FLYC-300 can communicate seamlessly with the flight controller through configurable UART, Ethernet, and CAN ports. It also accommodates a wide voltage input range from 4S to 14S battery packs via the XT30 DC-IN connector. The system is compatible and supports 5G/4G module installation for real-time images, videos, and data transmission.
FLYC-300 can elevate unmanned systems by combining vision devices with a powerful NVIDIA Jetson-based AI platform. Intelligent autonomous UAV and UGV systems can deliver enhanced operational effectiveness, risk reduction, and real-time information, making them a valuable repertoire. With its 297-gram ultra-lightweight design and versatile connectivity, FLYC-300 is ready for integration and deployment into real-world applications.
| Manufacturer | Neousys |
|---|---|
| Short Description | Neousys FLYC-300 is an NVIDIA Jetson Orin NX mission computer tailor-made for UAV and UGV applications. Designed to coincide and collaborate with the flight controller responsible for stabilizing and controlling the drone’s flight, FLYC-300 fuels compelling 100 TOPS AI performance. It combines versatile sensors to empower drones' true autonomy and advance applications such as autonomous navigation, obstacle avoidance, object detection, and tracking. |
| Processor | NVIDIA Jetson Orin NX system-on-module (SOM), comprising NVIDIA Ampere GPU and ARM Cortex CPU |
| Memory | 8GB/ 16GB LPDDR5 @ 3200 MHz on SOM |
| Video Port | 1x DisplayPort connector |
| M.2 | 1x M.2 2230 M key socket NVMe interface (Gen4 x4) |
| DC Input | XT-30 for 12V to 60V DC input Supports 4S-14S battery pack |
| Fan | Optional external-accessible 65mm x 65mm fan for system heat dissipation |
| Dimension | 124mm x 123mm x 29.8mm (Excluded enclosure) 124mm x 123mm x 30.5mm (Included enclosure) |
| Weight | 297g (Excluding enclosure) 345g (Including enclosure) |
| Mounting | Wall Mount |
| Operating Temperature | -25°C to 40°C (No Heat Spreader Required) -25°C to 60°C (Heat Spreader Required) -25°C to 70°C (Heat Spreader Required) |
| Storage Temperature | -40°C to 85°C |
| Humidity | 10%~90% , non-condensing |
| Vibration | Operating, MIL-STD-810G, Method 514.6, Category 4 |
| Shock | Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| EMC | CE/FCC Class A, according to EN 55032 & EN 55035 |