Industrial Computing
Fanless Computers
FANLESS COMPUTERS
Rugged, Expandable, Passive Heat Management
The advent of the fanless industrial computer ignited a revolution that persists to this day. Previously, the heat management of a computer's CPU and other components relied solely on fans. This introduced dust, dirt, and debris while constraining the environments in which PCs could operate, ultimately limiting their lifespan.
The fanless PC has transcended its initial role in factory settings thanks to its enhanced reliability, versatility, and design adaptability. This innovation has opened a world of possibilities, extending its reach to various applications and environments. Engineers, designers, and users are no longer bound by the limitations of traditional computing solutions. They now have the freedom to deploy computational power wherever they desire.
Contact us today to find the right fanless solution to fit your needs.
Fanless Heat Management
In fanless configurations, heat dissipation relies on direct contact between the CPU and a metal plate facilitated by a conductive paste layer. This plate acts as a conduit for passive heat transfer from components such as memory modules. Through convection, fins on the plate efficiently disperse warm air away from the system, ensuring optimal thermal performance without needing a fan.
Superior Design Solution
The fanless design is a natural choice for rugged applications due to its absence of moving parts. This design ensures superior equipment performance and longevity by eliminating the necessity for circulating dusty, dirty, or damp air over electrical components. Moreover, eliminating bulky fans results in a significantly higher compute power density per cubic inch than traditional industrial equipment.
Variety of Configurations
It might seem contradictory, but a fanless computer can incorporate a fan. A GPU computer is a good example. A fan using external air cools the GPU and related components, and the compute elements are housed in a separate fanless compartment. This innovative setup allows for adding various components in separate sections (cassettes), making the fanless platform both functional and highly flexible.
Fanless Computers
POC-400 Series
POC-400/410- Intel® Elkhart Lake Atom® x6425E quad-core 1.8GHz/ 3.0GHz 12W processor
- Rugged -25 °C to 70 °C fanless operation
- 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
- 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
- M.2 2280 M key SATA interface
- Dual DP display outputs supporting 4096 x 2160 resolution
- Front I/O access DIN-mounting design
- MezIO™ compatible
Starting at $635.00
POC-40 Extreme Compact Embedded Controller
POC-40 Series- Intel Elkhart Lake Atom x6211E dual-core processor
- 49 x 89 x 112 mm extremely compact form factor
- Rugged -25°C to 70°C fanless wide-temperature operation
- Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
- M.2 2280 M key SATA storage interface
- One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
- One M.2 E key socket for WiFi 5/ WiFi 6 modules
- One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports
Starting at $515.00
Neousys POC-451 Series
POC-451VTC- Intel® Atom® x6425E quad-core processor
- Rugged -25°C to 70°C fanless operation
- 2x 2.5GbE PoE+ ports and 1x 2.5GbE port
- 1x M.2 2242/ 3052 B key for 4G/5G module
- 2x M.2 2230 E key for WIFI and edge TPU module
- Conduction-cooled heatsink for M.2/ mPCIe modules
- Dual M.2 2280 M key for SATA SSD
- 8~35V DC input with built-in ignition power control
Starting at $825.00