Compact

• Intel Elkhart Lake Atom x6211E dual-core processor
• 49 x 89 x 112 mm extremely compact form factor
• Rugged -25°C to 70°C fanless wide-temperature operation
• Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
• M.2 2280 M key SATA storage interface
• One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
• One M.2 E key socket for WiFi 5/ WiFi 6 modules
• One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

• AMD Ryzen™ embedded V1000 series quad-core 15W/ 45W CPU
• -25°C to 70°C rugged wide-temperature operation
• Four Gigabit PoE+ ports with screw-lock
• Four USB 3.0 ports with screw-lock
• M.2 2280 M key NVMe (Gen3 x2) socket for fast storage access
• DP + VGA dual display outputs
• Front I/O access and DIN-rail mounting design
• MezIO™ compatible

• NVIDIA Jetson AGX Orin SoM bundled with JetPack 5.1.1
• NVIDIA Jetson AGX Orin Industrial bundled with JetPack 6.0
• Rugged -25°C to 70°C fanless operation (JAO32/JAO64)
  • No throttling at 55°C with JAO64 MAXN Mode
• Rugged -40°C to 75°C fanless operation (JAOi)
  • No throttling at 55°C with JAO64 MAXN Mode
• IP66 waterproof and dustproof
• -25°C to 70°C fanless operation
• Support 8x GMSL2 FAKRA Z automotive cameras (NRU-230V-AWP)
• 4x PoE+ GbE and 1x 10GBASE-T via M12 X-coded connectors
• 2x isolated CAN 2.0, 1x RS232, and 1x isolated RS485 via M12 A-coded connectors
• 1x system monitoring port by automotive-grade MCU
• 8V to 48V wide-range DC input with built-in ignition power control

• Intel Alder Lake Core i3-N305 processor 15W with 8 E-Cores or Atom x7425E
• Up to 16GB DDR5-4800 SODIMM
• -25 °C to 70 °C rugged wide temperature operation
• 4x GbE ports PoE+ / 4x USB3.2 Gen 2 with screw-lock
• M.2 2280 M key SATA socket
• DP++ / HDMI 1.4b dual display outputs
• 4-CH isolated DI + 4-CH isolated DO
• Front I/O access DIN-mounting design
• MezIO compatible
• UL certification (UL-US-2409582-0)
• Complies with UL 62368-1 standards

• Intel Elkhart Lake Atom x6413E processor
• 52 x 89 x 112 mm extremely compact form factor
• Rugged -25°C to 70°C fanless wide-temperature operation
• Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
• M.2 2280 M key SATA storage interface
• One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
• One M.2 E key socket for WiFi 5/ WiFi 6 modules
• One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

• Intel® Elkhart Lake Atom® x6425E quad-core 1.8GHz/ 3.0GHz 12W processor
• Rugged -25 °C to 70 °C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
• 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
• M.2 2280 M key SATA interface
• Dual DP display outputs supporting 4096 x 2160 resolution
• Front I/O access DIN-mounting design
• MezIO™ compatible

• Intel Celeron J3455 processor
• Robust design with high stability
• 2 x GbE, 2 x USB3.0, 2 x USB2.0, 4 x RS232, 2 x RS485, 1 x HDMI, 1 x VGA
• Compact size with fanless design
• Rubber stopper design for stand mount and optional kit for DIN-rail mount.
• Optional 3G/GPS/GPRS/Wi-Fi communication
• Threaded DC Jack design for more steady power supply
• Optimized mechanical design for easier RAM swapping

• 12th Gen Intel Core i Processor (up to 10 cores)
• Dual Channel DDR5-4800 up to 64GB
• M.2 E-Key, B-Key, M-Key (supports NVMe) expansion for storage/wireless
• Equipped with CANBus for reliable communication
• DC-in terminal block for wiring flexibility
• Supports multiple displays for ThinManager solution
• Supports software APIs, DeviceOn

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Rugged, -25 °C to 70 °C fanless operation
• Two IEEE 803.3at PoE+ ports and one GbE port
• One isolated CAN port for in-vehicle communication
• One M.2 socket and three mini-PCIe sockets
• Aluminum heat-spreader for M.2/ mPCIe modules
• 4-CH isolated DI and 4-CH isolated DO
• 8~35V DC input with built-in ignition power control

• Intel® Atom® x6425E quad-core processor
• Rugged -25°C to 70°C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port
• 1x M.2 2242/ 3052 B key for 4G/5G module
• 2x M.2 2230 E key for WIFI and edge TPU module
• Conduction-cooled heatsink for M.2/ mPCIe modules
• Dual M.2 2280 M key for SATA SSD
• 8~35V DC input with built-in ignition power control

• AMD Ryzen embedded V1605B quad-core 15W CPU
• -40°C to 70°C rugged wide temperature fanless operation
• Four IEEE 802.3at PoE+ ports with screw-lock
• One isolated CAN bus port for in-vehicle communication
• One M.2 socket and three mPCIe sockets
• M.2 2280 M key NVMe (Gen3 x2) socket for fast storage access
• 4-CH isolated DI and 4-CH isolated DO
• 8~35V DC input with built-in ignition power control
• E-Mark and EN 50155/ EN 45545 certificate

• Intel Alder Lake Core i3-N305 processor 15W with 8 E-Cores
• 4x GbE PoE+ ports/ 4x USB3.2 Gen 2 with screw-lock
• DP++/ HDMI 1.4b dual display outputs
• 2x isolated CAN 2.0 port, supporting SocketCAN in Linux
• 2x mPCIe for WiFi/ 4G/ 5G module with conduction-cooled heatsink
• 8-CH isolated DI & 8-CH isolated DO
• 8V - 35V DC input with built-in ignition power control
• E-Mark certified and EN 50155 EMC compliant

Main Features:

• Intel® Apollo Lake Pentium® N4200
• Rugged, -25°C to 70°C fanless operation
• x3 GbE port
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Pentium® N4200
• Rugged, -25°C to 70°C fanless operation
• One GbE port and two Gigabit PoE+ ports
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Rugged, -25°C to 70°C fanless operation
• x3 GbE port
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Fanless and rugged, wide temperature operation (-25°C to 70°C)
• One GbE port and two Gigabit PoE+ ports
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

• 212 x 165 x 63 mm low-profile design
• Intel 14th/13th/12th -Gen Core 35W/ 65W LGA1700 CPU
• Rugged, -25°C to 60°C fanless operation
• 4x 2.5GbE with optional PoE+ and 4x USB3.2 Gen 1 with screw-lock
• M.2 2280 Gen4x4 NVMe and 1x hot-swappable HDD tray for storage
• 4-CH isolated DI and 4-CH isolated DO
• VGA + DP dual display outputs
• Optional ignition power control

• 212 x 165 x 45 mm low-profile design with flattop heatsink
• Intel 13th-Gen Core 65W/35W LGA1700 CPU
• Rugged, -25°C to 60°C fanless operation
• 4x 2.5GbE with optional PoE+ and 4x USB3.2 Gen 1 with screw-lock
• 1x M.2 2280 Gen4 x4 NVMe and 1x hot-swappable HDD tray for storage
• 4-CH isolated DI and 4-CH isolated DO
• VGA + DP dual display output
• Optional ignition power control

Main Features:

• Compact 255 x 173 x 76 mm footprint
• Intel® 9th/ 8th-Gen Core™ 35W LGA1151 CPU
• Rugged, -25°C to 60°C fanless operation
• 2x GbE and 4x USB3.0
• 2x RS-232/422/485 and 2x RS-232 ports
• VGA + DVI dual display outputs
• Supports 1x M.2 2280 SSD (SATA signal)
• Supports 1x 3.5" or 2.5" SATA HDD/ SSD

• Intel 8th-Gen. Coffee Lake Core i7/i5/i3 CPU
• Wide temperature operation, -25°C ~70°C
• On-board CAN bus
• Isolated digital I/O
• 6x GbE ports (PoE+ ports 3~6)
• 4x USB3.1 Gen. 2/ 4x USB3.0 Gen. 1
• 4K2K resolution, VGA/DVI/DP triple independent display support
• 8~35V wide-range DC input with built-in ignition power control

Main Features

• Intel® 9th/ 8th-Gen Core™ i hexa-core 35W/ 65W LGA1151 CPU
• Low-profile chassis with hot-swappable 2.5” HDD/ SSD tray
• MezIO™ interface for easy function expansion
• Rugged, -25°C to 70°C fanless operation
• Up to 6x GigE ports, supporting 9.5 KB jumbo frame
• M.2 2280 M key socket (Gen3 x4) supporting NVMe SSD or Intel® Optane™ memory
• 4x USB 3.1 Gen2 ports and 4x USB 3.1 Gen1 ports
• VGA/ DVI/ DP triple independent display, supporting 4K2K resolution

• Compact 221 x 173 x 76 mm footprint
• Supports Intel^® 6th-Gen Core^™ i7/i5/i3 LGA 1151 socket CPU
• Rugged, -25°C to 70°C fanless operation
• 3x GbE and 4x USB 3.0 ports
• 2x RS-232/422/485 ports and 2x RS-232 ports
• VGA + DVI dual display outputs
• Accommodates one 3.5" HDD or 2.5" HDD/SSD
• Optional 8-CH isolated DI and 8-CH isolated DO

Main Features:

• Supports Intel 6th-Gen Core i7/i5/i3 LGA1151 CPU
• 4x 802.3at Gigabit PoE+ ports via M12 connectors
• On-board CAN bus for in-vehicle communication
• 4-CH isolated DI and 4-CH isolated DO
• 2x SATA ports for two 2.5" SATA HDD/SSD, with one hot-swappable HDD tray, supporting RAID 0/1
• 4x full-size mini-PCIe sockets with SIM support
• 8~35V wide-range DC input with built-in ignition control
• E-Mark and EN 50155 certificate

Main Features:

• Intel® 6th Gen Core™ i7/i5/i3 35W/65W socket-type CPU
• MezIO™ interface for easy function expansion
• Rugged, wide temperature range from -25°C to 70°C fanless operation
• Up to 6x GigE ports, supporting 9.5 KB jumbo frame
• Up to 32 GB, DDR4-2133 SODIMM
• One hot-swappable 2.5" HDD/SSD and one fixed 2.5" HDD/SSD, supporting RAID 0/1
• Accommodates two 2.5" SATA HDD/SSD with RAID 0/1
• VGA/DVI/DP triple independent display, supporting 4K/2K
• 77 mm low-profile design

• AMD Ryzen™ embedded V1605B series quad-core 15W CPU
• Rugged -25°C to 70°C fanless operation
• 4x 4K DP display, 3840 x 2160 resolution per output
• AI inference capability by 2x optional Edge TPU
• 1x M.2 3042/3052 B-Key for 4G/5G module
• 2x USB3.1 Gen 1 and 2x USB2.0
• 8V to 35V wide-range DC input with built-in ignition power control
• Flexible power input options: mini-DIN or terminal block

• Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/ 3.0GHz 12W processor
• Rugged -40°C to 70°C fanless operation, compliant with EN 50155 Class OT4
• 4x PoE+ GbE ports via M12 x-coded connectors
• 1x front-accessible 2.5” 15mm HDD tray and 1x M.2 2280 SATA SSD
• 1x M.2 3042/3052 B Key for 4G/5G mobile broadband
• 2x full-size mini-PCIe sockets for WIFI/CAN/GNSS modules
• 8-35V wide-range DC input with built-in ignition power control

• Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/ 3.0GHz 12W processor
• Rugged -25°C to 70°C fanless operation
• 4x Gigabit PoE+ ports via RJ-45 connector with screw-lock
• 1x isolated RS-485 port and 1x RS-422/485 or 3x 3-wire RS-232 ports
• 2x full-size mini-PCIe sockets and 1x M.2 3042/3052 B key
• 1x front-accessible 2.5” SATA SSD tray (up to 15mm height) and 1x M.2 2280 SATA
• 1x patented Cassette for single-slot PCIe card (Nuvo-2600E), or 1x 2500 watt-second SuperCAP UPS (Nuvo-2600J)
• 8V to 35V wide-range DC input with remote control and optional ignition power control

• AMD Ryzen embedded V1807B quad-core 45W CPU
• Integrated Vision Specific I/O
  • 4-CH CC/CV lighting controller
  • 4-CH camera trigger outputs
  • 1-CH quadrature encoder input
  • 8-CH isolated DI and 8-CH isolated DO
• Patented MCU-based, real time I/O control by DTIO V2 and NuMCU
• Built-in camera interfaces
  • Four Gigabit PoE+ ports with screw-lock
  • Four USB 3.1 ports with screw-lock
• M.2 2280 M key NVMe (Gen3x2) socket for fast storage access

Main Features

• Powered by NVIDA Jetson Orin or Xavier NX SOM bundled with JetPack
• Ruggesd -25-70C fanless operation
• 4x IEEE 802.3bt PoE++ GbE ports with screw-lock
• 2x mini-PCIe sockets for WiFi/GNSS/NVMe/CAN modules
• 1x 3042/3052 M.2 B key socket for 4G/5G mobile communication
• 1x hardware configurable RS232/422/485 port
• 8V-35V wide range DC imput with built-in ignition power control
• MIL-STD-810G and EN 50155 certified

• Powered by NVIDIA Jetson Orin NX or Xavier NX SOM bundled with JetPack 5.1.1
• Rugged -25°C to 60°C fanless operation
• Support 4x GMSL2 automotive cameras via FAKRA Z connectors
• 1x 10GBASE-T 10Gb and 1x 1GBASE-T 1Gb Ethernet port
• 2x mini-PCIe sockets for WiFi/GNSS/NVMe/CAN modules
• 1x M.2 3042/ 3052 B key socket for 4G/5G mobile communication
• 1x isolated CAN 2.0, 1x configurable RS232/422/485 port, and 1x GPS PPS input
• 8V to 35V wide-range DC input with built-in ignition power control

• NVIDIA Jetson AGX Orin SoM bundled with JetPack 5.1.1
• NVIDIA Jetson AGX Orin Industrial bundled with JetPack 6.0
• Rugged -25°C to 70°C fanless operation (JAO32/ JAO64)
• No throttling at 65°C with JAO64 MAXN Mode
• Rugged -40°C to 75°C fanless operation (JAOi)
• No throttling at 75°C with JAOi 35W Mode
• 2x 2.5 Gigabit Ethernet + 4x IEEE 802.3at Gigabit PoE+ ports
• 2x front-accessible 2.5” SSD trays
• 1x M.2 2280 M key socket for NVMe SSD
• 2x mini-PCIe sockets for WiFi/ GNSS/ NVMe/ CAN modules
• 1x 3042/ 3052 M.2 B key socket for 4G/5G mobile communication
• 1x isolated RS-485 and 2x RS232 ports
• 8V to 48V wide-range DC input with built-in ignition power control

• Powered by NVIDIA Jetson AGX Xavier SOM bundled with JetPack 4.4
• 4x IEEE 802.3at Gigabit PoE+ ports with screw lock
• 2x front-accessible, hot swappable 2.5" HDD/SSD trays
• 1x mini-PCIe socket for WiFi/4G module
• 1x isolated CAN bus port and 1x RS-232 port with flow control
• 1x GPS PPS input, 3-CH isolated DI and 4-CH isolated DO
• 8~35V wide-range DC input with built-in ignition power control