Internet of Things

• 212 x 165 x 63 mm low-profile design
• Intel 13th-Gen Core™ 35W/65W LGA1700 CPU
• Rugged, -25°C to 60°C fanless operation
• 4x GbE and 4x USB3.2 Gen 1 with screw-lock
• 1x hot-swappable HDD tray and 1x M.2 2280 Gen4 x4 NVMe
• 2x full-size mPCIe sockets
• 4-CH isolated DI and 4-CH isolated DO
• VGA + DP dual display outputs

Main Features:

• Supports Intel 12/13th-Gen 35W/65W CPUs
• Patented Cassette for PCI/PCIe add-on card accommodation
• Rugged, -25°C to 70°C fanless operation
• Up to 5x 2.5GbE and 1x GigE ports with optional PoE+, supporting 9.5 KB jumbo frame
• 1x USB 3.2 Gen2x2 type-C and 8x USB 3.2/ 2.0 type-A ports
• Supports M.2 Gen4x4 NVMe and 2x SATA ports
• MezIO™ interface for easy function expansion
• VGA/ DVI/ DP triple independent display, supporting 4K2K resolution

Main Features:

• Supports Intel 12/13th-Gen 35W/65W CPUs
• Patented Cassette for PCI/PCIe add-on card accommodation
• Rugged, -25°C to 70°C fanless operation
• Up to 5x 2.5GbE and 1x GigE ports with optional PoE+, supporting 9.5 KB jumbo frame
• 1x USB 3.2 Gen2x2 type-C and 8x USB 3.2/ 2.0 type-A ports
• Supports M.2 Gen4x4 NVMe and 2x SATA ports
• MezIO™ interface for easy function expansion
• VGA/ DVI/ DP triple independent display, supporting 4K2K resolution

Main Features

NVIDIA® Jetson Nano™ embedded

• 1 x M.2 2280 NVMe for storage
• 1 x Mini PCIe for expansion
• Linux OS with BSP (board support package)
• Supports deep learning trained models 

• 212 x 165 x 45 mm low-profile design with flattop heatsink
• Intel 13th-Gen Core 65W/35W LGA1700 CPU
• Rugged, -25°C to 60°C fanless operation
• 4x 2.5GbE with optional PoE+ and 4x USB3.2 Gen 1 with screw-lock
• 1x M.2 2280 Gen4 x4 NVMe and 1x hot-swappable HDD tray for storage
• 4-CH isolated DI and 4-CH isolated DO
• VGA + DP dual display output
• Optional ignition power control