MIC-770 V3: Compact Fanless System with Intel 14th/13th/12th-Gen CPU (LGA 1700)
MIC-770 V3Starting at $1,355.00
- Intel 14th/13th/12th-Gen CPU socket-type (LGA1700) with Intel R680E/H610E chipset
- Wide operating temperature (-20 ~ 60 °C)
- VGA and HDMI output
- 2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1)
- 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)
- 1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2
- 9 ~ 36 VDC input power range
- IP40 dust proof for deployment in harsh environment
- Supports FlexIO and iDoor technology, flexible configure additional HDMI, DP, DVI, COM port, DIO, Remote switch IO
- Supports Advantech i-Modules
- Supports Advantech SUSIAPI and embedded software APIs
- Supports Intel vPro/AMT and TPM technologies
- Supports Advantech iBMC 1.2 remote out-of-band power management solution on DeviceOn
Frequently Asked Questions
The MIC-770 V3 uses a socket-type LGA1700 design supporting 12th, 13th, and 14th Gen Intel Core i CPUs, plus Pentium and Celeron options, paired with an Intel R680E or H610E chipset depending on SKU. Cores range from 2 to 24 depending on the model chosen.
The system provides 2 x GigaLAN (RJ45), 1 x VGA (DB15), 1 x HDMI, and serial ports (2 x RS-232/422/485 via DB9, expandable to 4 x RS-232 via optional cable). USB varies by SKU: the R680E (W) SKU has 2 x USB 3.2 Gen2, 6 x USB 3.2 Gen1, and 1 x internal USB 2.0; the H610E (H) SKU has 4 x USB 3.2 Gen1 and 4 x USB 2.0. Audio includes 1 x line-out and 1 x mic-in.
The MIC-770 V3 accepts 9~36 VDC input via a 4-pin Phoenix connector. Typical power consumption is 45.7W, with a maximum of 108W. The absolute maximum voltage rating is 9V-36V, with a minimum recommended input of 12V (-25%) to 30V (+20%).
Operating temperature depends on CPU TDP and chassis version. For the Standard version (with 0.7 m/s airflow) using a 35W CPU, the range is -20 ~ 60°C; using a 65W CPU, it is -20 ~ 50°C. For the Extreme version (no airflow), a 35W CPU supports -20 ~ 50°C and a 65W CPU supports -20 ~ 35°C. All figures require an industrial wide-temperature SSD. Storage temperature is -40 ~ 85°C.
The system carries CE/FCC Class A, CCC, and BSMI EMC certifications, and CB/UL, CCC, BSMI safety certifications. It also has an IP40 dust-proof rating.
The MIC-770 V3 supports 1 x 2.5" HDD/SSD (expandable to 2 x 2.5" SSD with an optional kit, or 2 x 3.5" HDD via i-Module), 1 x mSATA, and 1 x NVMe M.2 (M-Key 2280, PCIe Gen4 x4, R680E SKU only). Memory uses dual-channel DDR5 4800MHz via 2 x 260-pin SODIMM sockets, up to 32GB per socket (64GB max total); the R680E SKU supports ECC memory.
The MIC-770 V3 supports Windows 11, Windows 10, Windows 10 IoT, and Linux OS.
The Standard version measures 77 x 192 x 230 mm (3.07" x 7.55" x 9.05") and weighs 2.8 kg. The Extreme version measures 107.3 x 192 x 230 mm (4.22" x 7.55" x 9.05") and weighs 4.5 kg. Installation is supported via desktop or wall mount; optional DIN-rail and wall mounting kits are also available.
The W SKU (R680E chipset) supports NVMe M.2 storage, RAID 0/1/5/10, 2 x USB 3.2 Gen2, 6 x USB 3.2 Gen1, 1 x internal USB 2.0, and 4 independent displays. The H SKU (H610E chipset) does not support NVMe M.2 or RAID, has 4 x USB 3.2 Gen1 and 4 x USB 2.0, and supports 3 independent displays. The H SKU also does not support the MIC-75M20-01 or MIC-75G30 expansion modules.
Yes, the R680E (W) SKU is equipped with a WISE-iBMC out-of-band management solution, allowing remote power-on, power-off, reset, and force-shutdown via LAN2 if abnormal OS conditions occur. This function operates through Advantech's WISE-DeviceOn software.
How-to Guides
- Undo the 4 screws and remove the bottom cover.
- Undo the 4 screws to remove the HDD tray.
- Secure the HDD with 4 x HDD screws (P/N: 1930002235).
- Assemble the SATA cable and power cable, then replace the HDD tray and secure it with 4 screws.
- Replace the bottom cover.
- Undo the 4 screws to remove the bottom cover.
- Undo 7 screws to remove the memory thermal cover, install the memory module, and affix the thermal pad (P/N: 1990019498N000).
- Undo 3 screws to remove the memory thermal cover if reinstalling.
- Affix the thermal pad to the memory and reassemble the memory thermal cover, ensuring the pad and cover are fully seated and secured.
- Undo 4 screws and remove the bottom cover.
- Install the module in Mini PCIe socket 1, or the mSATA module in Mini PCIe socket 2, and secure with screws.
- Replace the bottom cover and secure it with screws.
- Locate the 4-pin power header on the front of the unit, rated for 9~36 VDC input.
- Connect wires according to the pin assignment: Pin 1 = GND, Pin 2 = +9~36 VDC, Pin 3 = +9~36 VDC, Pin 4 = GND.
- Use the supplied 4-pin Phoenix power connector (P/N: 1652003234) to make the connection.
- Verify the voltage of the power source is correct before connecting to the equipment.
- Undo the 4 screws and remove the bottom cover.
- Remove the HDD tray and expansion module baffle.
- Remove the baffle cover.
- Assemble the selected Flex I/O or i-Module (e.g., MIC-75M10, AIIS-DIO32, PCA-TPMSPI) onto the motherboard, connecting any required cable per the MB internal I/O connector reference.
- Assemble the module baffle with screws.
- Replace the bottom cover and secure with screws.
| Manufacturer | Advantech |
|---|---|
| CPU Family | Intel Celeron, Intel Core, Intel Pentium |
| Base CPU Speed | Under 2.0 Ghz, 2.1 to 3.0 GHz, 3.1 to 3.5 GHz, Over 3.5 GHz |
| Video Output | VGA, HDMI |
| USB 2.0 | 1-2, 3-4 |
| USB 3.2 | 1 - 4, 5 - 8 |
| Max Memory | 2 GB, 4 GB, 8 GB, 16 GB, 32 GB, 64 GB |
| Form Factor | Fanless |
| BIOS | AMI 256Mb/128Mb SPI Flash |
| Certification | EMC: CE/FCC Class A, CCC, BSMI |
| CPU | 12th Generation Processor (TDP 35W): i9-12900TE, i7-12700TE, i5-12500TE, i3-12100TE, Pentium G7400TE, Celeron G6900TE 12th Generation Processor (TDP 65W): i9-12900(E), i7-12700(E), i5-12500(E), i3-12100(E), G7400E (46W), G6900E (46W) |
| Memory | Technology Dual-channel DDR4 2933/2666 MHz (W480E SKU supports ECC) Socket 2 x 260-pin DDR4 SODIMM (up to 32GB per socket) Maximum Capacity 64GB |
| Storage | HDD: 1 x 2.5" HDD/SSD (up to 2 x 2.5" SSD by optional kit; 2 x 3.5" HDD by i-Module) mSATA: 1 NVMe: M.2 1 x M Key 2280 with PCIe Gen 4 x 4 (R680E SKU, operating temp. -20 ~ 50 °C) RAID: 0/1/5/10 (R680E SKU only) |
| I/O | USB: R680E: 2 x USB3.2 (Gen2), 6 x USB3.2 (Gen1), 1 x USB 2.0 (Internal) H610E: 4 x USB3.2 (Gen1), 4 x USB2.0 Serial Port: 2 x DB9, RS-232/422/485 support auto flow control; 4 x RS-232 (Optional) Audio: 2 (1 x line out and 1 x mic in) |
| Expansion Slots | Module: Supports Advantech i-Modules Mini PCIe/mSATA: R680E: 1 x mini PCIe, 1 x mini PCIe/mSATA H610E: 1 x mini PCIe, 1 x mSATA |
| Watchdog TImer | Output: System reset Programmable: 1 ~ 255 sec/min |
| Humidity | 95% @ 40 °C (non-condensing) |
| Operating Temperature | 65W CPU w/ industrial wide Temp. SSD: -20 ~ 50 °C with 0.7 m/s air flow 35W CPU w/ industrial wide Temp. SSD: -20 ~ 60 °C with 0.7 m/s air flow Non-operating: -40 ~ 85 C |
| Shock | With SSD: 20G, IEC-68-2-27, half-sine wave, 11 ms duration |
| Power Input Voltage | 9 ~ 36 VDC |
| Power Consumption | 9~19VDC support total 140W, 19~36V support total 180W for system and Peripheral card |
| Weight | 2.8 kg (6.17 lbs) |
| Dimension | 77 x 192 x 230 mm (3.07" x 7.55" x 9.05") |