Neousys

Main Features:

• Intel Celeron Bay Trail J1900 quad-core processor
• 1x PCIe x4 + 2x PCI slots
• Rugged, -25°C to 70°C fanless operation
• Dual independent display via DVI-I connector
• 2x SATA ports for 2.5" HDD/SSD
• 2x RS-232/422/485 + 2x RS-232
• Optional isolated 8-ch DI and 8-ch DO
• 8 to 25 VDC wide-range DC input

Main Features:

• Intel Celeron Bay Trail J1900 quad-core processor
• 3x PCI slots
• Rugged, -25°C to 70°C fanless operation
• Dual independent display via DVI-I connector
• 2x SATA ports for 2.5" HDD/SSD
• 2x RS-232/422/485 + 2x RS-232
• Optional isolated 8-ch DI and 8-ch DO
• 8 to 25 VDC wide-range DC input

• Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/ 3.0GHz 12W processor
• Rugged -40°C to 70°C fanless operation, compliant with EN 50155 Class OT4
• 4x PoE+ GbE ports via M12 x-coded connectors
• 1x front-accessible 2.5” 15mm HDD tray and 1x M.2 2280 SATA SSD
• 1x M.2 3042/3052 B Key for 4G/5G mobile broadband
• 2x full-size mini-PCIe sockets for WIFI/CAN/GNSS modules
• 8-35V wide-range DC input with built-in ignition power control

Main Features:

• 210 mm x 165 mm x 59 mm very compact size
• Intel 3rd-Gen i7/i5 PGA-type processor
• User-configurable CPU power mode for adapting to various environments
• 4x IEEE 802.3at (25.5W) Gigabit PoE ports
• DVI/VGA + DisplayPort triple independent display outputs
• Dual 2.5 inch SATA ports with one hot-swappble HDD tray
• 8 ~ 35V wide-range DC input and built-in ignition power control
• E-Mark certification for in-vehicle applications

Main Features:

• 212 x 165 x 63 mm low-profile design
• Intel 9th/8th Gen Core 35W LGA1151 CPU
• Rugged, -25C to 60C fanless operation
• 4x GbE and 4x USB 3.1Gen1 with screw lock
• 1 hot swappable HDD/SSD tray and 1x M.2 2280 socket for storage
• 4-CH isolated DI and 4-CH isolated DO
• DVI-I + DP dual display outputs
• Optional ignition power control

Main Features:

• Supports 250W NVIDIA® graphics card up to 14 TFLOPS in FP32
• Supports Intel® Xeon® E or 8th/ 9th-Gen Core™ i7/ i5 LGA1151 CPU
• Up to 128GB ECC/ non-ECC DDR4 2133 (4x SODIMM)
• One x 16 (8-lanes), two x 8 (4-lanes), Gen3 PCIe slots for add-on cards
• 2 x M.2 B key and 3 x full-size mini-PCIe sockets
• 8~35V wide-range DC input with built-in ignition power control
• Patented thermal design for -25°C to 60°C rugged operation
• Patented damping brackets to withstand 1 Grms vibration

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Fanless and rugged, wide temperature operation (-25°C to 70°C)
• One GbE port and two Gigabit PoE+ ports
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Rugged, -25°C to 70°C fanless operation
• x3 GbE port
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Pentium® N4200
• Rugged, -25°C to 70°C fanless operation
• One GbE port and two Gigabit PoE+ ports
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Pentium® N4200
• Rugged, -25°C to 70°C fanless operation
• x3 GbE port
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Rugged, -25 °C to 70 °C fanless operation
• Two IEEE 803.3at PoE+ ports and one GbE port
• One isolated CAN port for in-vehicle communication
• One M.2 socket and three mini-PCIe sockets
• Aluminum heat-spreader for M.2/ mPCIe modules
• 4-CH isolated DI and 4-CH isolated DO
• 8~35V DC input with built-in ignition power control