Internet of Things

• Intel Elkhart Lake Atom x6211E dual-core processor
• 49 x 89 x 112 mm extremely compact form factor
• Rugged -25°C to 70°C fanless wide-temperature operation
• Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
• M.2 2280 M key SATA storage interface
• One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
• One M.2 E key socket for WiFi 5/ WiFi 6 modules
• One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

• Intel® Atom® x6425E quad-core processor
• Rugged -25°C to 70°C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port
• 1x M.2 2242/ 3052 B key for 4G/5G module
• 2x M.2 2230 E key for WIFI and edge TPU module
• Conduction-cooled heatsink for M.2/ mPCIe modules
• Dual M.2 2280 M key for SATA SSD
• 8~35V DC input with built-in ignition power control

• Powered by AMD® EPYC™ 7003 series processors, supporting up to 64-core/ 128-thread
• Supports one NVIDIA® RTX A6000/ A4500 with proprietary heat dissipation
• Rugged -25°C to 60°C operation for edge applications
• 2x 10G Ethernet by Intel® X550-AT2 and 4x GbE by Intel® I350-AM4
• Supports 4x DDR4 RDIMM/ LRDIMM up to 512GB of memory
• Compact 2U 19” rack-mount enclosure with only 350mm depth
• Four easy-swappable 2.5” SATA trays for 7mm HDD/ SSD
• 8~48V wide-range DC input with built-in ignition power control

• AMD Ryzen™ embedded V1605B series quad-core 15W CPU
• Rugged -25°C to 70°C fanless operation
• 4x 4K DP display, 3840 x 2160 resolution per output
• AI inference capability by 2x optional Edge TPU
• 1x M.2 3042/3052 B-Key for 4G/5G module
• 2x USB3.1 Gen 1 and 2x USB2.0
• 8V to 35V wide-range DC input with built-in ignition power control
• Flexible power input options: mini-DIN or terminal block

• AMD Ryzen embedded V1807B quad-core 45W CPU
• Integrated Vision Specific I/O
  • 4-CH CC/CV lighting controller
  • 4-CH camera trigger outputs
  • 1-CH quadrature encoder input
  • 8-CH isolated DI and 8-CH isolated DO
• Patented MCU-based, real time I/O control by DTIO V2 and NuMCU
• Built-in camera interfaces
  • Four Gigabit PoE+ ports with screw-lock
  • Four USB 3.1 ports with screw-lock
• M.2 2280 M key NVMe (Gen3x2) socket for fast storage access

• Powered by NVIDIA Jetson AGX Xavier SOM bundled with JetPack 4.4
• Support 8x GMSL automotive cameras via FAKRA Z connectors
• 1x 10 GBASE-T 10G Ethernet port
• 1x M.2 2280 M key socket for NVMe SSD
• 1x miniPCIe socket for WiFi/4G module
• 1x Isolated CAN bus port and 1x RS-232 port with flow control
• 1x GPS PPS input, 3-CH isolated DI and 4-CH isolated DO
• 8V to 35V wide-range DC imnput with built-in ignition power control

Main Features:

• Intel Apollo Lake Atom E3940 1.6GHz processor with built in 8GB DDR3L memory
• Wide range power input 10-36V
• Wide operating temperature range -40-70C
• 2x DP++ features high resolution and enables compatibility to HDMI/DVI via economy priced passive adapter
• On board TMP 2.0 to provide hardware based security
• Modular design for optional iDoor extension kit
• DIN Rail power supplies and backups
• Proven by UL/IEC 61010 to meet industrial controller standard

Main Features

• Powered by NVIDA Jetson Xavier NX SOM bundled with JetPack 4.6
• Ruggesd -25-70C fanless operation
• 4x IEEE 802.3bt PoE++ GbE ports with screw-lock
• 2x mini-PCIe sockets for WiFi/GNSS/NVMe/CAN modules
• 1x 3042/3052 M.2 B key socket for 4G/5G mobile communication
• 1x hardware configurable RS232/422/485 port
• 8V-35V wide range DC imput with built-in ignition power control
• MIL-STD-810G and EN 50155 certified

• Powered by NVIDIA Jetson AGX Orin SoM bundled with JetPack 5.1.1
• Rugged -25°C to 70°C fanless operation (No throttling at 65°C with 64GB AGX Orin MAXN Mode)
• 2x 2.5 Gigabit Ethernet + 4x IEEE 802.3at Gigabit PoE+ ports
• 2x front-accessible 2.5” SSD trays
• 1x M.2 2280 M key socket for NVMe SSD
• 2x mini-PCIe sockets for WiFi/GNSS/NVMe/CAN modules
• 1x 3042/ 3052 M.2 B key socket for 4G/5G mobile communication
• 1x isolated RS-485 and 2x RS232 ports
• 8V to 48V wide-range DC input with built-in ignition power control