Intelligent Transportation

• Intel® Atom® x6425E quad-core processor
• Rugged -25°C to 70°C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port
• 1x M.2 2242/ 3052 B key for 4G/5G module
• 2x M.2 2230 E key for WIFI and edge TPU module
• Conduction-cooled heatsink for M.2/ mPCIe modules
• Dual M.2 2280 M key for SATA SSD
• 8~35V DC input with built-in ignition power control

• Intel® Elkhart Lake Atom® x6425E quad-core 1.8GHz/ 3.0GHz 12W processor
• Rugged -25 °C to 70 °C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
• 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
• M.2 2280 M key SATA interface
• Dual DP display outputs supporting 4096 x 2160 resolution
• Front I/O access DIN-mounting design
• MezIO™ compatible

• Supports Intel® 9th / 8th Core™ i7/ i5/ i3 LGA1151 socket-type CPU
• 4x or 8x 802.3at Gigabit PoE+ ports via M12 or RJ45 connectors
• Onboard isolated CAN bus for in-vehicle communication
• 4-CH isolated DI and 4-CH isolated DO
• 2x hot-swappable SATA HDD trays, supporting RAID 0/1
• 2x M.2 B key and 3x full-size mini-PCIe sockets
• 8~35V wide-range DC input with built-in ignition power control
• Patented Cassette for PCIe add-on card accommodation*
• E-Mark and EN 50155 certificate

• AMD Ryzen™ embedded V1605B quad-core 15W CPU
• -40°C to 70°C rugged wide temperature fanless operation
• Four IEEE 802.3at PoE+ ports with screw-lock
• One isolated CAN bus port for in-vehicle communication
• One M.2 socket and three mPCIe sockets
• M.2 2280 M key NVMe (Gen3 x2) socket for fast storage access
• 4-CH isolated DI and 4-CH isolated DO
• 8~35V DC input with built-in ignition power control
• E-Mark and EN 50155/ EN 45545 certificate

• Compact 221 x 173 x 76 mm footprint
• Supports Intel^® 6th-Gen Core^™ i7/i5/i3 LGA 1151 socket CPU
• Rugged, -25°C to 70°C fanless operation
• 3x GbE and 4x USB 3.0 ports
• 2x RS-232/422/485 ports and 2x RS-232 ports
• VGA + DVI dual display outputs
• Accommodates one 3.5" HDD or 2.5" HDD/SSD
• Optional 8-CH isolated DI and 8-CH isolated DO

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Rugged, -25 °C to 70 °C fanless operation
• Two IEEE 803.3at PoE+ ports and one GbE port
• One isolated CAN port for in-vehicle communication
• One M.2 socket and three mini-PCIe sockets
• Aluminum heat-spreader for M.2/ mPCIe modules
• 4-CH isolated DI and 4-CH isolated DO
• 8~35V DC input with built-in ignition power control

Main Features:

• Intel® Apollo Lake Pentium® N4200
• Rugged, -25°C to 70°C fanless operation
• x3 GbE port
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Pentium® N4200
• Rugged, -25°C to 70°C fanless operation
• One GbE port and two Gigabit PoE+ ports
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Rugged, -25°C to 70°C fanless operation
• x3 GbE port
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Fanless and rugged, wide temperature operation (-25°C to 70°C)
• One GbE port and two Gigabit PoE+ ports
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

• AMD Ryzen™ embedded V1000 series quad-core 15W/ 45W CPU
• -25°C to 70°C rugged wide-temperature operation
• Four Gigabit PoE+ ports with screw-lock
• Four USB 3.0 ports with screw-lock
• M.2 2280 M key NVMe (Gen3 x2) socket for fast storage access
• DP + VGA dual display outputs
• Front I/O access and DIN-rail mounting design
• MezIO™ compatible