Industrial Computing

Main Features

• Supports LGA 1151 Intel® Xeon® & 8th Generation Core™ i7/i5/i3 processors
• DDR4 2666/2400/2133 MHz ECC/Non-ECC UDIMM up to 64 GB
• 1 Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCIe x1 slots
• Triple displays - DVI-D, VGA and HDMI 2.0 ports
• 8 SATA3 ports and four USB 3.1 ports
• 2 X RJ45 Ethernet Connectors
• Rackmount optimized placement with positive air flow design
• 0 ~ 60° C ambient operation temperature range

Main Features

• Intel® 8th/9th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q370/H310 chipset
• Wide operating temperature (-10 ~ 50 °C)
• VGA and HDMI output
• 2 x GigaLAN, 2 x USB 3.1 and 6 x USB 3.0
• 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)
• 1 x 2.5" HDD/SSD, and 1 x mSATA
• 9 ~ 36 VDC input power range
• Supports FlexIO and iDoor technology, flexible configure additional HDMI, DVI, Comport, DIO, Remote switch IO
• Supports Advantech i-Modules
• Supports Advantech SUSIAPI and embedded software APIs

• AMD Ryzen™ embedded V1605B series quad-core 15W CPU
• Rugged -25°C to 70°C fanless operation
• 4x 4K DP display, 3840 x 2160 resolution per output
• AI inference capability by 2x optional Edge TPU
• 1x M.2 3042/3052 B-Key for 4G/5G module
• 2x USB3.1 Gen 1 and 2x USB2.0
• 8V to 35V wide-range DC input with built-in ignition power control
• Flexible power input options: mini-DIN or terminal block

Main Features:

• Supports 250W NVIDIA® graphics card up to 14 TFLOPS in FP32
• Supports Intel® Xeon® E or 8th/ 9th-Gen Core™ i7/ i5 LGA1151 CPU
• Up to 128GB ECC/ non-ECC DDR4 2133 (4x SODIMM)
• One x 16 (8-lanes), two x 8 (4-lanes), Gen3 PCIe slots for add-on cards
• 2 x M.2 B key and 3 x full-size mini-PCIe sockets
• 8~35V wide-range DC input with built-in ignition power control
• Patented thermal design for -25°C to 60°C rugged operation
• Patented damping brackets to withstand 1 Grms vibration

Main Features:

• Supports dual NVIDIA® Tesla T4 GPU
• Supports Intel® Xeon® E or 9th/ 8th-Gen Core™ i7/ i5 LGA1151 CPU
• Up to 128GB ECC/ non-ECC DDR4 2133 (4x SODIMM)
• Two x8 (4-lanes), Gen3 PCIe slots for add-on cards
• 1x M.2 M key, 1x M.2 B key and 2x full-size mini-PCIe sockets
• 8~48V wide-range DC input with built-in ignition power control
• Proven thermal design for -25°C to 60°C rugged operation*
• Patented damping brackets* to withstand 3 Grms vibration

• Intel Elkhart Lake Atom x6211E dual-core processor
• 49 x 89 x 112 mm extremely compact form factor
• Rugged -25°C to 70°C fanless wide-temperature operation
• Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
• M.2 2280 M key SATA storage interface
• One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
• One M.2 E key socket for WiFi 5/ WiFi 6 modules
• One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

• Powered by AMD® EPYC™ 7003 series processors, supporting up to 64-core/ 128-thread
• Supports one NVIDIA® RTX A6000/ A4500 with proprietary heat dissipation
• Rugged -25°C to 60°C operation for edge applications
• 2x 10G Ethernet by Intel® X550-AT2 and 4x GbE by Intel® I350-AM4
• Supports 4x DDR4 RDIMM/ LRDIMM up to 512GB of memory
• Compact 2U 19” rack-mount enclosure with only 350mm depth
• Four easy-swappable 2.5” SATA trays for 7mm HDD/ SSD
• 8~48V wide-range DC input with built-in ignition power control