Internet of Things

Main Features:

• Supports Intel 12/13th-Gen 35W/65W CPUs
• Patented Cassette for PCI/PCIe add-on card accommodation
• Rugged, -25°C to 70°C fanless operation
• Up to 5x 2.5GbE and 1x GigE ports with optional PoE+, supporting 9.5 KB jumbo frame
• 1x USB 3.2 Gen2x2 type-C and 8x USB 3.2/ 2.0 type-A ports
• Supports M.2 Gen4x4 NVMe and 2x SATA ports
• MezIO™ interface for easy function expansion
• VGA/ DVI/ DP triple independent display, supporting 4K2K resolution

• Intel Elkhart Lake Atom x6211E dual-core processor
• 49 x 89 x 112 mm extremely compact form factor
• Rugged -25°C to 70°C fanless wide-temperature operation
• Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
• M.2 2280 M key SATA storage interface
• One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
• One M.2 E key socket for WiFi 5/ WiFi 6 modules
• One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

• 212 x 165 x 63 mm low-profile design
• Intel 13th-Gen Core™ 35W/65W LGA1700 CPU
• Rugged, -25°C to 60°C fanless operation
• 4x GbE and 4x USB3.2 Gen 1 with screw-lock
• 1x hot-swappable HDD tray and 1x M.2 2280 Gen4 x4 NVMe
• 2x full-size mPCIe sockets
• 4-CH isolated DI and 4-CH isolated DO
• VGA + DP dual display outputs

Main Features:

• Supports Intel 12/13th-Gen 35W/65W CPUs
• Patented Cassette for PCI/PCIe add-on card accommodation
• Rugged, -25°C to 70°C fanless operation
• Up to 5x 2.5GbE and 1x GigE ports with optional PoE+, supporting 9.5 KB jumbo frame
• 1x USB 3.2 Gen2x2 type-C and 8x USB 3.2/ 2.0 type-A ports
• Supports M.2 Gen4x4 NVMe and 2x SATA ports
• MezIO™ interface for easy function expansion
• VGA/ DVI/ DP triple independent display, supporting 4K2K resolution

• Intel® Atom® x6425E quad-core processor
• Rugged -25°C to 70°C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port
• 1x M.2 2242/ 3052 B key for 4G/5G module
• 2x M.2 2230 E key for WIFI and edge TPU module
• Conduction-cooled heatsink for M.2/ mPCIe modules
• Dual M.2 2280 M key for SATA SSD
• 8~35V DC input with built-in ignition power control

• AMD Ryzen™ embedded V1605B series quad-core 15W CPU
• Rugged -25°C to 70°C fanless operation
• 4x 4K DP display, 3840 x 2160 resolution per output
• AI inference capability by 2x optional Edge TPU
• 1x M.2 3042/3052 B-Key for 4G/5G module
• 2x USB3.1 Gen 1 and 2x USB2.0
• 8V to 35V wide-range DC input with built-in ignition power control
• Flexible power input options: mini-DIN or terminal block

• Intel® Elkhart Lake Atom® x6425E quad-core 1.8GHz/ 3.0GHz 12W processor
• Rugged -25 °C to 70 °C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
• 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
• M.2 2280 M key SATA interface
• Dual DP display outputs supporting 4096 x 2160 resolution
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Rugged, -25 °C to 70 °C fanless operation
• Two IEEE 803.3at PoE+ ports and one GbE port
• One isolated CAN port for in-vehicle communication
• One M.2 socket and three mini-PCIe sockets
• Aluminum heat-spreader for M.2/ mPCIe modules
• 4-CH isolated DI and 4-CH isolated DO
• 8~35V DC input with built-in ignition power control

Main Features:

• Intel® Apollo Lake Pentium® N4200
• Rugged, -25°C to 70°C fanless operation
• x3 GbE port
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Pentium® N4200
• Rugged, -25°C to 70°C fanless operation
• One GbE port and two Gigabit PoE+ ports
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Rugged, -25°C to 70°C fanless operation
• x3 GbE port
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Fanless and rugged, wide temperature operation (-25°C to 70°C)
• One GbE port and two Gigabit PoE+ ports
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

• 212 x 165 x 45 mm low-profile design with flattop heatsink
• Intel 13th-Gen Core 65W/35W LGA1700 CPU
• Rugged, -25°C to 60°C fanless operation
• 4x 2.5GbE with optional PoE+ and 4x USB3.2 Gen 1 with screw-lock
• 1x M.2 2280 Gen4 x4 NVMe and 1x hot-swappable HDD tray for storage
• 4-CH isolated DI and 4-CH isolated DO
• VGA + DP dual display output
• Optional ignition power control