Main Features

• Intel® 8th/9th generation Core™ i7/i5/i3 & Pentium®/Celeron® processor with Q370 chipset.
• Four DIMM sockets up to 64 GB DDR4 2400/2666
• Triple display VGA/DVI-D/DP and dual GbE LAN
• SATA RAID 0, 1, 5, 10, USB 3.1
• Supports Intel vPro, AMT & TPM technologies
• Note 1: TPM module is required to enable Intel vPro and TPM technologies.
• Note 2: Intel 8th generation processors only support Windows 10 (64-bit).

Main Features

• Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipset
• Four DIMM sockets up to 128 GB DDR4 2933
• Triple display DP/DVI-D/VGA and dual GbE LAN
• M.2, SATA RAID 0, 1, 5, 10, USB 3.2
• Supports Intel vPro, AMT & TPM technologie

Note 1: TPM module is required to enable Intel vPro and TPM technologies. Note 2: Legacy platform is not supported.

Main Features 

• LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset
• DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB
• One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots
• Triple displays - DVI-D, VGA, and HDMI 2.0 ports
• Five SATA 3 ports and four x USB 3.2 ports
• One M.2 2280/2242 (SATA / PCIe compatible)
• Rackmount optimized placement with positive air flow design
• 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range

Note: Supported OS including Windows 10 (64-bit) and Server 2019 (64-bit) have been validated.

Main Features

• Intel® Atom™ E3815/E3825 processor with 4GB DDR3L onboard memory
• 2 x GbE, 1 x USB 3.0, 1 x HDMI, option 2 x RS-232/422/485 or 3 x USB2.0
• Compact fanless design
• Rubber stopper design with internal reserved screws for 2nd layer assembly
• Diverse system I/O and isolated digital I/O by iDoor technology
• Supports Fieldbus protocol by iDoor technology
• Supports 30+ iDoor combination with four main categories of smart factory applications
• 32GB eMMC storage onboard

Main Features

• Fanless and ultra-compact design
• NVIDIA Jetson Nano/ Xavier NX embedded
• 1 x M.2 2280 NVMe for storage
• Linux OS with BSP (board support package) 
• Supports deep learning trained models
• Wide-operating temperature range 

Main Features

• UL listed for hazardous locations: Class I, Division 2
• Intel® Atom E3845 1.91GHz processor with 4GB DDR3L memory
• 3 x GbE, 3 x USB, 2 x COM, 1 x VGA, 1 x HDMI, audio, iDoor, mSATA,
• 2 x mPCIe, 1 x SATA, 4 x DI, 4 x DO, 1 x power terminal
• Spark-free design with lockable I/O kit
• Dual power input for avoiding power down time
• Exchangeable RTC battery with easy access on the top
• Digital I/O with isolation protection for sensing and controlling
• Diverse system IO and supports fieldbus protocol by idoor technology as a protocol gateway
• 3G/GPS/GPRS/Wi-Fi communication by idoor technology as a communication gateway
• Supports MRAM by iDoor technology
• LAN redundancy (teaming)

Main Feature

• Intel® 10th Gen Xeon®/Core™ i CPU socket-type (LGA1200) with Intel® W480E/H420E chipset
• Wide operating temperature (-10 ~ 60 °C)
• VGA and HDMI output
• 2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1)
• 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)
• 1 x 2.5" HDD/SSD, and 1 x mSATA
• 9 ~ 36 VDC input power range
• IP40 dust proof for deployment in harsh environment
• Supports FlexIO and iDoor technology, flexible configure additional HDMI, DVI, Comport, DIO, Remote switch IO
• Supports Advantech i-Modules
• Supports Advantech SUSIAPI and embedded software APIs

Main Features

• Automation kit featuring an industrial-grade I/O board for creating RPi-based IoT systems
• Industrial grade I/O board utilizing RS-232/485 and GPIO for flexible expansion
• Battery-backed RTC enabling fail-safe time keeping
• Included OS enables RPi identification of UNO-220, and automatically configures GPIOs and drivers for the board
• Easy 4-step RPi 4 installation
• Supports wall-mount and DIN rail installation for industrial applications
• Supports TPM hardware security upon request

Main Features

• Fanless and ultra-compact design
• NVIDIA Jetson Nano/ Xavier NX embedded
• 1 x M.2 2280 NVMe for storage
• Linux OS with BSP (board support package) 
• Supports deep learning trained models
• Wide-operating temperature range 

Main Features

• 11th gen Intel® Core™ i processor with 8 GB DDR4 memory
• Wide operating temperature range (-20 ~ 60 °C/-4 ~ 140 °F)
• 8 x DI, 8 x DO, and 4 x COM with isolation protection
• 1 x M.2 (M key) for 2280 NVMe SSD storage
• 1 x M.2 (B key) for 2242 storage and 3042/3052 cellular modules
• 1 x M.2 (E key) for 2230 Wi-Fi modules
• Supports Time-Sensitive Networking (TSN) technology
• Remote out-of-band (OOB) power management with Advantech’s iBMC technology
• Embedded TPM 2.0 for hardware-based security
• Modular design for optional iDoor extension
• Compliant with IEC 61010-2-201 safety requirements

• Intel 12th/13th/14th Gen Core i CPU socket-type (LGA1700) with Intel R680E/H610E chipset
• Wide operating temperature (-20 ~ 60 °C)
• VGA and HDMI output
• 2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1)
• 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)
• 1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2
• 9 ~ 36 VDC input power range
• IP40 dust proof for deployment in harsh environment
• Supports FlexIO and iDoor technology, flexible configure additional HDMI, DP, DVI, COM port, DIO, Remote switch IO
• Supports Advantech i-Modules
• Supports Advantech SUSIAPI and embedded software APIs
• Supports Intel vPro/AMT and TPM technologies
• Supports Advantech iBMC 1.2 remote out-of-band power management solution on DeviceOn