Industrial Computing

• 6x GMSL2 FAKRA Z inputs supporting automotive GMSL2 cameras
• Turnkey solution with pre-installed GMSL2 camera driver for selected cameras
• Powered by NVIDIA® Jetson Xavier™ NX bundled with JetPack 4.6.1
• 21 TOPS AI performance with up to 22 streams simultaneous 1080p@30FPS video encoding capability
• x2 Gen3 PCI Express interface offering 10Gb/s total bandwidth
• 1x GPS PPS input for frame sync calibration
• 1x isolated CAN 2.0 and 1x RS232
• -25°C to 60°C operating temperature with airflow

• Powered by NVIDIA® Jetson Orin™ NX bundled with JetPack 5.1
• Single-slot half-length PCIe card form factor
• 4x PoE+ 2.5 GbE ports with a 50W total power budget
• 100 TOPS AI inference performance capable of up to four simultaneous streams of 4K@30FPS video decoding
• 1x isolated RS-485 and 1x RS-232
• x1 Gen2 PCI Express interface offering 2.5Gb/s total bandwidth
• -25°C to 60°C operating temperature with airflow

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Fanless and rugged, wide temperature operation (-25°C to 70°C)
• One GbE port and two Gigabit PoE+ ports
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Rugged, -25°C to 70°C fanless operation
• x3 GbE port
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Pentium® N4200
• Rugged, -25°C to 70°C fanless operation
• One GbE port and two Gigabit PoE+ ports
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Pentium® N4200
• Rugged, -25°C to 70°C fanless operation
• x3 GbE port
• Two USB 3.0 and two USB 2.0 ports
• DVI + VGA dual display outputs
• Front I/O access DIN-mounting design
• MezIO™ compatible

Main Features:

• Intel® Apollo Lake Atom™ E3950 quad-core processor
• Rugged, -25 °C to 70 °C fanless operation
• Two IEEE 803.3at PoE+ ports and one GbE port
• One isolated CAN port for in-vehicle communication
• One M.2 socket and three mini-PCIe sockets
• Aluminum heat-spreader for M.2/ mPCIe modules
• 4-CH isolated DI and 4-CH isolated DO
• 8~35V DC input with built-in ignition power control

• Intel Elkhart Lake Atom x6211E dual-core processor
• 49 x 89 x 112 mm extremely compact form factor
• Rugged -25°C to 70°C fanless wide-temperature operation
• Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
• M.2 2280 M key SATA storage interface
• One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
• One M.2 E key socket for WiFi 5/ WiFi 6 modules
• One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

• Intel® Elkhart Lake Atom® x6425E quad-core 1.8GHz/ 3.0GHz 12W processor
• Rugged -25 °C to 70 °C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
• 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
• M.2 2280 M key SATA interface
• Dual DP display outputs supporting 4096 x 2160 resolution
• Front I/O access DIN-mounting design
• MezIO™ compatible

• Intel® Atom® x6425E quad-core processor
• Rugged -25°C to 70°C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port
• 1x M.2 2242/ 3052 B key for 4G/5G module
• 2x M.2 2230 E key for WIFI and edge TPU module
• Conduction-cooled heatsink for M.2/ mPCIe modules
• Dual M.2 2280 M key for SATA SSD
• 8~35V DC input with built-in ignition power control

• Industrial-grade 15" XGA TFT LCD with 70K lifetime and LED backlight
• 8th Gen. Intel® Core™ i3- 8145UE dual-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMM
• Dual channel memory slots support up to 64G in total
• Compact, fanless embedded system with aluminum alloy front bezel and chassis grounding protection
• True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel
• Support expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G)
• Diverse system I/O and isolated digital I/O via iDoor technology
• Support fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technology
• Support TPM2.0 hardware security

Main Features

• 11th gen Intel® Core™ i processor with 8 GB DDR4 memory
• Wide operating temperature range (-20 ~ 60 °C/-4 ~ 140 °F)
• 8 x DI, 8 x DO, and 4 x COM with isolation protection
• 1 x M.2 (M key) for 2280 NVMe SSD storage
• 1 x M.2 (B key) for 2242 storage and 3042/3052 cellular modules
• 1 x M.2 (E key) for 2230 Wi-Fi modules
• Supports Time-Sensitive Networking (TSN) technology
• Remote out-of-band (OOB) power management with Advantech’s iBMC technology
• Embedded TPM 2.0 for hardware-based security
• Modular design for optional iDoor extension
• Compliant with IEC 61010-2-201 safety requirements