Industrial Computing

Main Features

• Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipset
• Four DIMM sockets up to 128 GB DDR4 2933
• Triple display DP/DVI-D/VGA and dual GbE LAN
• M.2, SATA RAID 0, 1, 5, 10, USB 3.2
• Supports Intel vPro, AMT & TPM technologie

Note 1: TPM module is required to enable Intel vPro and TPM technologies. Note 2: Legacy platform is not supported.

Main Features:

• Intel Atom Processor E3825 Dual Core 1.33 GHz SoC
• 1 x 2.5" SATA HDD/SSD Bay
• 1 x GbE & 1 x VGA & 1 x GPIO
• 1 x RS-232 & 1 x RS-232/422/485
• 1 x Full-Size MiniPCIe (ex. WLAN or WWAN module)
• 1 x Half Size MiniPCIe (ex. mSATA)
• Optional VESA / DIN Rail / Wall Mounting kits
• Threaded DC jack design
• Supports SUSIAccess and Embedded Software APIs

Main Features:

• Supports an NVIDIA 350W GPU (Gen4 x16 PCIe)
• Dedicated GPU-locking bracket
• Intel 12th/13th-Gen Core™ 35W/ 65W LGA1700 CPU
• Up to 64GB ECC/ non-ECC DDR5 4800 with Intel R680E chipset (2x SODIMM)
• Three x8 PCIe slots (Gen3 x4) for add-on cards
• 6x USB 3.2, 2x 2.5GbE, 1x GbE, and 1x optional 10GbE
• Two front-accessible tray storage options: 1x 2.5" SATA and 1x optional NVMe
• 8V to 48V wide-range DC input with ignition power control
• -25°C to 60°C wide temperature operation

Main Features:

• Supports dual NVIDIA RTX series 350W GPUs with patent-pending locking mechanism
• Intel 12th/13th-Gen Core 35W/65W LGA1700 CPU
• Up to 64GB DDR5 4800 with Intel R680E PCH (2x SODIMM)
• Three x8, Gen3 PCIe slots (x4 signal) for add-on cards
• 2x 2.5GbE and 1x GbE and 1x optional 10GBASE-T Ethernet
• 1x internal M.2 NVMe, 2x 2.5" SATA trays and 1x optional NVMe tray
• Support 8 to 48V wide-range DC input with ignition power control
• Rugged, -25°C to 60°C operation

• AMD Ryzen™ embedded V1605B series quad-core 15W CPU
• Rugged -25°C to 70°C fanless operation
• 4x 4K DP display, 3840 x 2160 resolution per output
• AI inference capability by 2x optional Edge TPU
• 1x M.2 3042/3052 B-Key for 4G/5G module
• 2x USB3.1 Gen 1 and 2x USB2.0
• 8V to 35V wide-range DC input with built-in ignition power control
• Flexible power input options: mini-DIN or terminal block

Main Features:

• 212 x 165 x 63 mm low-profile design
• Intel 9th/8th Gen Core 35W LGA1151 CPU
• Rugged, -25C to 60C fanless operation
• 4x GbE and 4x USB 3.1Gen1 with screw lock
• 1 hot swappable HDD/SSD tray and 1x M.2 2280 socket for storage
• 4-CH isolated DI and 4-CH isolated DO
• DVI-I + DP dual display outputs
• Optional ignition power control

Main Features:

• Supports dual NVIDIA® Tesla T4 GPU
• Supports Intel® Xeon® E or 9th/ 8th-Gen Core™ i7/ i5 LGA1151 CPU
• Up to 128GB ECC/ non-ECC DDR4 2133 (4x SODIMM)
• Two x8 (4-lanes), Gen3 PCIe slots for add-on cards
• 1x M.2 M key, 1x M.2 B key and 2x full-size mini-PCIe sockets
• 8~48V wide-range DC input with built-in ignition power control
• Proven thermal design for -25°C to 60°C rugged operation*
• Patented damping brackets* to withstand 3 Grms vibration

• Intel Elkhart Lake Atom x6211E dual-core processor
• 49 x 89 x 112 mm extremely compact form factor
• Rugged -25°C to 70°C fanless wide-temperature operation
• Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
• M.2 2280 M key SATA storage interface
• One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
• One M.2 E key socket for WiFi 5/ WiFi 6 modules
• One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

Main Features

• 11th gen Intel® Core™ i processor with 8 GB DDR4 memory
• Wide operating temperature range (-20 ~ 60 °C/-4 ~ 140 °F)
• 8 x DI, 8 x DO, and 4 x COM with isolation protection
• 1 x M.2 (M key) for 2280 NVMe SSD storage
• 1 x M.2 (B key) for 2242 storage and 3042/3052 cellular modules
• 1 x M.2 (E key) for 2230 Wi-Fi modules
• Supports Time-Sensitive Networking (TSN) technology
• Remote out-of-band (OOB) power management with Advantech’s iBMC technology
• Embedded TPM 2.0 for hardware-based security
• Modular design for optional iDoor extension
• Compliant with IEC 61010-2-201 safety requirements