Industrial Computing

Main Features

• Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipset
• Four DIMM sockets up to 128 GB DDR4 2933
• Triple display DP/DVI-D/VGA and dual GbE LAN
• M.2, SATA RAID 0, 1, 5, 10, USB 3.2
• Supports Intel vPro, AMT & TPM technologie

Note 1: TPM module is required to enable Intel vPro and TPM technologies. Note 2: Legacy platform is not supported.

Main Features 

• LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset
• DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB
• One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots
• Triple displays - DVI-D, VGA, and HDMI 2.0 ports
• Five SATA 3 ports and four x USB 3.2 ports
• One M.2 2280/2242 (SATA / PCIe compatible)
• Rackmount optimized placement with positive air flow design
• 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range

Note: Supported OS including Windows 10 (64-bit) and Server 2019 (64-bit) have been validated.

• Fanless and ultra-compact design
• Embedded with NVIDIA Jetson Orin NX up to 100 TOPS
• Includes 128GB Standard Temp Commercial NVMe M.2
• Supports 1 x GbE, 2 x USB3.2 Gen1 (5Gbit/s)
• Supports 1 x mPCIe, 1 x M.2 3052, 1 x M.2 2280
• Supports Allxon 24/7 remote monitoring and OTA deployment

• Fanless compact design
• Embedded with NVIDIA® Jetson AGX Orin™ up to 275 TOPS
• Support 4x GbE (optional PoE), 4 x USB 3.2 Gen2 (10Gbit/s)
• Support 2 x mPCIe, 2 x Nano SIM slot
• Support 4x GbE (optional PoE, IEEE 802.3af/at)
• Support PCIex8 add on card by iModule
• Support Allxon 24/7 remote monitoring and OTA deployment; Azure Certified Devices

• 212 x 165 x 63 mm low-profile design
• Intel 13th-Gen Core™ 35W/65W LGA1700 CPU
• Rugged, -25°C to 60°C fanless operation
• 4x GbE and 4x USB3.2 Gen 1 with screw-lock
• 1x hot-swappable HDD tray and 1x M.2 2280 Gen4 x4 NVMe
• 2x full-size mPCIe sockets
• 4-CH isolated DI and 4-CH isolated DO
• VGA + DP dual display outputs

• 212 x 165 x 45 mm low-profile design with flattop heatsink
• Intel 13th-Gen Core 65W/35W LGA1700 CPU
• Rugged, -25°C to 60°C fanless operation
• 4x 2.5GbE with optional PoE+ and 4x USB3.2 Gen 1 with screw-lock
• 1x M.2 2280 Gen4 x4 NVMe and 1x hot-swappable HDD tray for storage
• 4-CH isolated DI and 4-CH isolated DO
• VGA + DP dual display output
• Optional ignition power control

• Intel Alder Lake Core i3-N305 processor 15W with 8 E-Cores or Atom x7425E
• Up to 16GB DDR5-4800 SODIMM
• -25 °C to 70 °C rugged wide temperature operation
• 4x GbE ports PoE+ / 4x USB3.2 Gen 2 with screw-lock
• M.2 2280 M key SATA socket
• DP++ / HDMI 1.4b dual display outputs
• 4-CH isolated DI + 4-CH isolated DO
• Front I/O access DIN-mounting design
• MezIO compatible
• UL certification (UL-US-2409582-0)
• Complies with UL 62368-1 standards

Main Features

• 11th gen Intel® Core™ i processor with 8 GB DDR4 memory
• Wide operating temperature range (-20 ~ 60 °C/-4 ~ 140 °F)
• 8 x DI, 8 x DO, and 4 x COM with isolation protection
• 1 x M.2 (M key) for 2280 NVMe SSD storage
• 1 x M.2 (B key) for 2242 storage and 3042/3052 cellular modules
• 1 x M.2 (E key) for 2230 Wi-Fi modules
• Supports Time-Sensitive Networking (TSN) technology
• Remote out-of-band (OOB) power management with Advantech’s iBMC technology
• Embedded TPM 2.0 for hardware-based security
• Modular design for optional iDoor extension
• Compliant with IEC 61010-2-201 safety requirements