Robotics

• Intel® Atom® x6425E quad-core processor
• Rugged -25°C to 70°C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port
• 1x M.2 2242/ 3052 B key for 4G/5G module
• 2x M.2 2230 E key for WIFI and edge TPU module
• Conduction-cooled heatsink for M.2/ mPCIe modules
• Dual M.2 2280 M key for SATA SSD
• 8~35V DC input with built-in ignition power control

• Intel Elkhart Lake Atom x6211E dual-core processor
• 49 x 89 x 112 mm extremely compact form factor
• Rugged -25°C to 70°C fanless wide-temperature operation
• Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
• M.2 2280 M key SATA storage interface
• One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
• One M.2 E key socket for WiFi 5/ WiFi 6 modules
• One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

Main Features

• Intel® Elkhart Lake Atom® x6425E quad-core 1.8GHz/ 3.0GHz 12W processor
• Rugged -25 °C to 70 °C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
• 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
• M.2 2280 M key SATA interface
• Dual DP display outputs supporting 4096 x 2160 resolution
• Front I/O access DIN-mounting design
• MezIO™ compatible

• Powered by NVIDIA Jetson AGX Xavier SOM bundled with JetPack 4.4
• 4x IEEE 802.3at Gigabit PoE+ ports with screw lock
• 2x front-accessible, hot swappable 2.5" HDD/SSD trays
• 1x mini-PCIe socket for WiFi/4G module
• 1x isolated CAN bus port and 1x RS-232 port with flow control
• 1x GPS PPS input, 3-CH isolated DI and 4-CH isolated DO
• 8~35V wide-range DC input with built-in ignition power control

Main Features

• Intel® 8th/9th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q370/H310 chipset
• Wide operating temperature (-10 ~ 50 °C)
• VGA and HDMI output
• 2 x GigaLAN, 2 x USB 3.1 and 6 x USB 3.0
• 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)
• 1 x 2.5" HDD/SSD, and 1 x mSATA
• 9 ~ 36 VDC input power range
• Supports FlexIO and iDoor technology, flexible configure additional HDMI, DVI, Comport, DIO, Remote switch IO
• Supports Advantech i-Modules
• Supports Advantech SUSIAPI and embedded software APIs

Main Features:

• Supports Intel® 6th Gen Core™ i7/i5/i3 35W/65W LGA1151 CPU
• Patented Cassette for PCI/PCIe add-on card accommodation
• MezIO™ interface for easy function expansion
• Rugged, wide temperature range from -25°C to 70°C fanless operation
• Up to 6x GigE ports, supporting 9.5 KB jumbo frame
• Up to 32 GB, DDR4-2133 SODIMM
• Accommodates two 2.5" SATA HDD/SSD with RAID 0/1
• VGA/DVI/DP triple independent display, supporting 4K2K

• Supports Intel® 6th-Gen Core™ i7/i5/i3 LGA1151 socket-type CPU
• 8x 802.3at PoE+ ports and 2x GbE ports
• 2x 3.5" HDD accommodation, support RAID 0/1 with over 24TB capacity
• Dedicated HDD heat-spreader for optimized thermal performance
• 4x full-size mini-PCIe sockets with SIM support
• 4-CH isolated DI and 4-CH isolated DO
• 1x CAN 2.0 port
• 8~35V wide-range DC input with built-in ignition power control
• Patented damping brackets to withstand 1Grms vibration

Main Features:

• Intel® 6th Gen Core™ i7/i5/i3 LGA1151 35W/65W
• Dual PCIe x8 slots in patented expansion Cassette
• MezIO™ interface for easy function expansion
• Rugged, wide temperature range from -25°C to 70°C fanless operation
• 6x GbE ports, supporting 9.5 KB jumbo frame
• Up to 32 GB, DDR4-2133 SODIMM
• Accommodates two 2.5" SATA HDD/ SSD with RAID 0/1 support
• VGA/ DVI/ DP triple independent display, supporting 4K/2K resolution

Main Features:

• Patent-pending thermal design to allow -25°C to 60°C wide temperature system operation
• Includes 6th-Gen Intel Core i7 or i5 LGA1151 CPU
• 6x GigE ports, supporting 9.5 KB jumbo frame
• Up to 32 GB, DDR4-2133 SODIMM
• 240 mm x 225 mm x 111 mm compact footprint
• Compatible with MezIO interface for function expansion
• Accommodates two 2.5" SATA HDD/SSD with RAID 0/1 support