Industrial Computing

Main Features

• Intel® 8th/9th generation Core™ i7/i5/i3 & Pentium®/Celeron® processor with Q370 chipset.
• Four DIMM sockets up to 64 GB DDR4 2400/2666
• Triple display VGA/DVI-D/DP and dual GbE LAN
• SATA RAID 0, 1, 5, 10, USB 3.1
• Supports Intel vPro, AMT & TPM technologies
• Note 1: TPM module is required to enable Intel vPro and TPM technologies.
• Note 2: Intel 8th generation processors only support Windows 10 (64-bit).

Main Features

• Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipset
• Four DIMM sockets up to 128 GB DDR4 2933
• Triple display DP/DVI-D/VGA and dual GbE LAN
• M.2, SATA RAID 0, 1, 5, 10, USB 3.2
• Supports Intel vPro, AMT & TPM technologie

Note 1: TPM module is required to enable Intel vPro and TPM technologies. Note 2: Legacy platform is not supported.

Main Features:

• EATX Server Board with dual Xeon E5-2600(v2) processor, PME flexible expansion and 128GB memory capacity
• DDR3 1600MHz RDIMM up to 128GB
• Three PCIe x16 slot(Gen3.0) + one PCIe x8 slot(Gen3.0) slots and PME expansion slot
• 0~40 C ambient operation temperature range
• Note: ASMB-922 could enable PME slot when processor is installed in CPU0 socket.

• Fanless compact design
• NVIDIA Jetson Xavier NX embedded
• Supports 1x mPCIe and 1x M.2 (PCIex4 NVMe)
• 2x LAN ports
• Bundle with Linux 18.04
• Low power consumption
• Support PCIe add on card
• Supports 24/7 secure remote monitoring, control, and OTA deployment - powered by Allxon (support JetPack 4.4GA and above)

• Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/ 3.0GHz 12W processor
• Rugged -40°C to 70°C fanless operation, compliant with EN 50155 Class OT4
• 4x PoE+ GbE ports via M12 x-coded connectors
• 1x front-accessible 2.5” 15mm HDD tray and 1x M.2 2280 SATA SSD
• 1x M.2 3042/3052 B Key for 4G/5G mobile broadband
• 2x full-size mini-PCIe sockets for WIFI/CAN/GNSS modules
• 8-35V wide-range DC input with built-in ignition power control

Main Features:

• 212 x 165 x 63 mm low-profile design
• Intel 9th/8th Gen Core 35W LGA1151 CPU
• Rugged, -25C to 60C fanless operation
• 4x GbE and 4x USB 3.1Gen1 with screw lock
• 1 hot swappable HDD/SSD tray and 1x M.2 2280 socket for storage
• 4-CH isolated DI and 4-CH isolated DO
• DVI-I + DP dual display outputs
• Optional ignition power control

Main Features

• Intel® 9th/ 8th-Gen Core™ i7/ i5/ i3, Pentium® and Celeron® LGA1151 CPU
• Supports NVIDIA® GPU up to 200W TDP
• An additional x4 PCIe, and a PCI slot for add-on cards
• -25°C to 60°C wide-temperature operation
• 2x GbE, 4x USB 3.1 Gen1 and 5x COM ports
• Dual DVI display outputs
• Up to 2x 2.5" SATA HDD/ SSD accommodation and 1x mSATA socket

Main Features:

• Supports Intel 12/13th-Gen 35W/65W CPUs
• Patented Cassette for PCI/PCIe add-on card accommodation
• Rugged, -25°C to 70°C fanless operation
• Up to 5x 2.5GbE and 1x GigE ports with optional PoE+, supporting 9.5 KB jumbo frame
• 1x USB 3.2 Gen2x2 type-C and 8x USB 3.2/ 2.0 type-A ports
• Supports M.2 Gen4x4 NVMe and 2x SATA ports
• MezIO™ interface for easy function expansion
• VGA/ DVI/ DP triple independent display, supporting 4K2K resolution

• Intel Elkhart Lake Atom x6211E dual-core processor
• 49 x 89 x 112 mm extremely compact form factor
• Rugged -25°C to 70°C fanless wide-temperature operation
• Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
• M.2 2280 M key SATA storage interface
• One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
• One M.2 E key socket for WiFi 5/ WiFi 6 modules
• One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

• Intel® Elkhart Lake Atom® x6425E quad-core 1.8GHz/ 3.0GHz 12W processor
• Rugged -25 °C to 70 °C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
• 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
• M.2 2280 M key SATA interface
• Dual DP display outputs supporting 4096 x 2160 resolution
• Front I/O access DIN-mounting design
• MezIO™ compatible

• Intel® Atom® x6425E quad-core processor
• Rugged -25°C to 70°C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port
• 1x M.2 2242/ 3052 B key for 4G/5G module
• 2x M.2 2230 E key for WIFI and edge TPU module
• Conduction-cooled heatsink for M.2/ mPCIe modules
• Dual M.2 2280 M key for SATA SSD
• 8~35V DC input with built-in ignition power control

Main Features

• 11th gen Intel® Core™ i processor with 8 GB DDR4 memory
• Wide operating temperature range (-20 ~ 60 °C/-4 ~ 140 °F)
• 8 x DI, 8 x DO, and 4 x COM with isolation protection
• 1 x M.2 (M key) for 2280 NVMe SSD storage
• 1 x M.2 (B key) for 2242 storage and 3042/3052 cellular modules
• 1 x M.2 (E key) for 2230 Wi-Fi modules
• Supports Time-Sensitive Networking (TSN) technology
• Remote out-of-band (OOB) power management with Advantech’s iBMC technology
• Embedded TPM 2.0 for hardware-based security
• Modular design for optional iDoor extension
• Compliant with IEC 61010-2-201 safety requirements