Industrial Computing

Main Features

• Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipset
• Four DIMM sockets up to 128 GB DDR4 2933
• Triple display DP/DVI-D/VGA and dual GbE LAN
• M.2, SATA RAID 0, 1, 5, 10, USB 3.2
• Supports Intel vPro, AMT & TPM technologie

Note 1: TPM module is required to enable Intel vPro and TPM technologies. Note 2: Legacy platform is not supported.

Main Features

• Supports LGA 1151 Intel® Xeon® & 8th Generation Core™ i7/i5/i3 processors
• DDR4 2666/2400/2133 MHz ECC/Non-ECC UDIMM up to 64 GB
• 1 Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCIe x1 slots
• Triple displays - DVI-D, VGA and HDMI 2.0 ports
• 8 SATA3 ports and four USB 3.1 ports
• 2 X RJ45 Ethernet Connectors
• Rackmount optimized placement with positive air flow design
• 0 ~ 60° C ambient operation temperature range

Main Features 

• LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset
• DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB
• One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots
• Triple displays - DVI-D, VGA, and HDMI 2.0 ports
• Five SATA 3 ports and four x USB 3.2 ports
• One M.2 2280/2242 (SATA / PCIe compatible)
• Rackmount optimized placement with positive air flow design
• 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range

Note: Supported OS including Windows 10 (64-bit) and Server 2019 (64-bit) have been validated.

Main Features:

• EATX Server Board with dual Xeon E5-2600(v2) processor, PME flexible expansion and 128GB memory capacity
• DDR3 1600MHz RDIMM up to 128GB
• Three PCIe x16 slot(Gen3.0) + one PCIe x8 slot(Gen3.0) slots and PME expansion slot
• 0~40 C ambient operation temperature range
• Note: ASMB-922 could enable PME slot when processor is installed in CPU0 socket.

• Fanless compact design
• NVIDIA Jetson Xavier NX embedded
• Supports 1x mPCIe and 1x M.2 (PCIex4 NVMe)
• 2x LAN ports
• Bundle with Linux 18.04
• Low power consumption
• Support PCIe add on card
• Supports 24/7 secure remote monitoring, control, and OTA deployment - powered by Allxon (support JetPack 4.4GA and above)

Main Features:

•   Intel® 6th Generation Core™ i7/i5/i3 BGA type CPU with Intel QM170 PCH
•   I-Module expansion module
•   VGA & DVI Interface
•   1 x 2.5" HDD/ 1 x CFast slot/ 1 x mSATA storage options
•   2 Giga LAN and 8x USB 3.0
•   2 x RS-232/422/485 & 2 x RS232 Serial ports
•   Isolation COM module & 32bit GPIO module
•   Supports wide power range of 9 ~ 36V DC input
•   Supports wide range operating Temperature of -20° ~ 60° C
•   Supports SUSIAccess and Embedded Software APIs

Main Features

• Intel® 8th/9th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q370/H310 chipset
• Wide operating temperature (-10 ~ 50 °C)
• VGA and HDMI output
• 2 x GigaLAN, 2 x USB 3.1 and 6 x USB 3.0
• 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)
• 1 x 2.5" HDD/SSD, and 1 x mSATA
• 9 ~ 36 VDC input power range
• Supports FlexIO and iDoor technology, flexible configure additional HDMI, DVI, Comport, DIO, Remote switch IO
• Supports Advantech i-Modules
• Supports Advantech SUSIAPI and embedded software APIs

• Powered by NVIDIA Jetson AGX Xavier SOM bundled with JetPack 4.4
• Support up to 8x GMSL automotive cameras via FAKRA Z connectors
• 1x 10 GBASE-T 10G Ethernet port
• 1x M.2 2280 M key socket for NVMe SSD
• 1x miniPCIe socket for WiFi/4G module
• 1x Isolated CAN bus port and 1x RS-232 port with flow control
• 1x GPS PPS input, 3-CH isolated DI and 4-CH isolated DO
• 8V to 35V wide-range DC imnput with built-in ignition power control

• Powered by NVIDIA Jetson AGX Xavier SOM bundled with JetPack 4.4
• 4x IEEE 802.3at Gigabit PoE+ ports with screw lock
• 2x front-accessible, hot swappable 2.5" HDD/SSD trays
• 1x mini-PCIe socket for WiFi/4G module
• 1x isolated CAN bus port and 1x RS-232 port with flow control
• 1x GPS PPS input, 3-CH isolated DI and 4-CH isolated DO
• 8~35V wide-range DC input with built-in ignition power control

Main Features:

• 212 x 165 x 63 mm low-profile design
• Intel 9th/8th Gen Core 35W LGA1151 CPU
• Rugged, -25C to 60C fanless operation
• 4x GbE and 4x USB 3.1Gen1 with screw lock
• 1 hot swappable HDD/SSD tray and 1x M.2 2280 socket for storage
• 4-CH isolated DI and 4-CH isolated DO
• DVI-I + DP dual display outputs
• Optional ignition power control

Main Features

• Intel® 9th/ 8th-Gen Core™ i7/ i5/ i3, Pentium® and Celeron® LGA1151 CPU
• Supports NVIDIA® GPU up to 200W TDP
• An additional x4 PCIe, and a PCI slot for add-on cards
• -25°C to 60°C wide-temperature operation
• 2x GbE, 4x USB 3.1 Gen1 and 5x COM ports
• Dual DVI display outputs
• Up to 2x 2.5" SATA HDD/ SSD accommodation and 1x mSATA socket

Main Features:

• Supports Intel 12/13th-Gen 35W/65W CPUs
• Patented Cassette for PCI/PCIe add-on card accommodation
• Rugged, -25°C to 70°C fanless operation
• Up to 5x 2.5GbE and 1x GigE ports with optional PoE+, supporting 9.5 KB jumbo frame
• 1x USB 3.2 Gen2x2 type-C and 8x USB 3.2/ 2.0 type-A ports
• Supports M.2 Gen4x4 NVMe and 2x SATA ports
• MezIO™ interface for easy function expansion
• VGA/ DVI/ DP triple independent display, supporting 4K2K resolution

Main Features:

• Supports Intel Xeon E3-1200v5 series, Core i7/i5/i3 LGA1151 processors with C236
• Dual Channel (ECC/Non-ECC) DDR4 2133/1600 up to 16 GB
• Supports PCIE 3.0, M.2, USB 3.0, SATA3.0, SW Raid 0, 1, 5, 10
• Supports CRT and 2 x DVI-D/DP(cable optional) display
• Supports out-of-band remote management with AMT10 and IPMI
• Supports Advantech LPC modules
• Supports SUSIAccess and Embedded Software APIs

• Intel Elkhart Lake Atom x6211E dual-core processor
• 49 x 89 x 112 mm extremely compact form factor
• Rugged -25°C to 70°C fanless wide-temperature operation
• Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
• M.2 2280 M key SATA storage interface
• One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
• One M.2 E key socket for WiFi 5/ WiFi 6 modules
• One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

Main Features

• 11th gen Intel® Core™ i processor with 8 GB DDR4 memory
• Wide operating temperature range (-20 ~ 60 °C/-4 ~ 140 °F)
• 8 x DI, 8 x DO, and 4 x COM with isolation protection
• 1 x M.2 (M key) for 2280 NVMe SSD storage
• 1 x M.2 (B key) for 2242 storage and 3042/3052 cellular modules
• 1 x M.2 (E key) for 2230 Wi-Fi modules
• Supports Time-Sensitive Networking (TSN) technology
• Remote out-of-band (OOB) power management with Advantech’s iBMC technology
• Embedded TPM 2.0 for hardware-based security
• Modular design for optional iDoor extension
• Compliant with IEC 61010-2-201 safety requirements

Main Features