Industrial Computing

Main Features:

• Supports Intel Core i7/i5/i3 processor with H61 chipset
• Two DIMM sockets support up to 8 GB DDR3 1066/1333 MHz SDRAM
• Supports dual display of VGA, DVI, LVDS and two GbE LAN
• Supports 10 COM, 10 USB 2.0, TPM 1.2 (optional)
• Supports SUSIAccess and Embedded Software APIs

Main Features:

• Supports Intel Core i7/i5/i3 processor with H61 chipset
• Two DIMM sockets support up to 8 GB DDR3 1066/1333 MHz SDRAM
• Supports dual display of VGA, DVI, LVDS and two GbE LAN
• Supports 10 COM, 10 USB 2.0, TPM 1.2 (optional)
• Supports SUSIAccess and Embedded Software APIs

Main Features

• Intel® 8th/9th generation Core™ i7/i5/i3 & Pentium®/Celeron® processor with Q370 chipset.
• Four DIMM sockets up to 64 GB DDR4 2400/2666
• Triple display VGA/DVI-D/DP and dual GbE LAN
• SATA RAID 0, 1, 5, 10, USB 3.1
• Supports Intel vPro, AMT & TPM technologies
• Note 1: TPM module is required to enable Intel vPro and TPM technologies.
• Note 2: Intel 8th generation processors only support Windows 10 (64-bit).

Main Features

• Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipset
• Four DIMM sockets up to 128 GB DDR4 2933
• Triple display DP/DVI-D/VGA and dual GbE LAN
• M.2, SATA RAID 0, 1, 5, 10, USB 3.2
• Supports Intel vPro, AMT & TPM technologie

Note 1: TPM module is required to enable Intel vPro and TPM technologies. Note 2: Legacy platform is not supported.

Main Features:

• Supports LGA 1151 Intel® Xeon® E and 8th Generation Core™ i7/i5/i3 processors
• DDR4 ECC/Non-ECC 2666/2400/2133 MHz UDIMM up to 64GB
• 1 PCIe x16,three PCIe x4 and one PCIe x1 slots
• Triple displays - DVI-D, VGA and HDMI 2.0 ports
• 8 SATA3 ports and 6 USB 3.1 ports
• 2 x RJ45 ports
• 0 ~ 60° C ambient operation temperature range

Main Features:

• Supports LGA 1151 Intel® Xeon® E and 8th Generation Core™ i7/i5/i3 processors
• DDR4 ECC/Non-ECC 2666/2400/2133 MHz UDIMM up to 64GB
• 1 PCIe x16,three PCIe x4 and one PCIe x1 slots
• Triple displays - DVI-D, VGA and HDMI 2.0 ports
• 8 SATA3 ports and 6 USB 3.1 ports
• 4 x RJ45 Ethernet Connectors
• 0°C ~ 60°C ambient operation temperature range

Main Features 

• LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset
• DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB
• One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots
• Triple displays - DVI-D, VGA, and HDMI 2.0 ports
• Five SATA 3 ports and four x USB 3.2 ports
• One M.2 2280/2242 (SATA / PCIe compatible)
• Rackmount optimized placement with positive air flow design
• 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range

Note: Supported OS including Windows 10 (64-bit) and Server 2019 (64-bit) have been validated.

• Fanless and ultra-compact design
• Embedded with NVIDIA Jetson Orin NX up to 100 TOPS
• Includes 128GB Standard Temp Commercial NVMe M.2
• Supports 1 x GbE, 2 x USB3.2 Gen1 (5Gbit/s)
• Supports 1 x mPCIe, 1 x M.2 3052, 1 x M.2 2280
• Supports Allxon 24/7 remote monitoring and OTA deployment

• Ruggedized IP67 waterproof fanless design
• Embedded with NVIDIA® Jetson Orin™ NX up to 100 TOPS
• 2 x GbE and 4 x PoE with IEEE 802.3af compliance
• 2 x USB 3.0, 1 x CANbus, 1 x HDMI
• Supports 2 x mPCIe, 1 x M.2 3052, 1 x M.2 2280
• Supports Allxon 24/7 remote monitoring and OTA deployment

• NVIDIA Jetson Xavier NX embedded
• Support 8CH PoE video Input
• Supports 2x 2.5"/3.5" drives
• Bundled with Linux Ubuntu 18.04 with BSP
• Low power consumption
• H.264/H.265 camera supported
• Jetpack 4.2.2 compatible

• AMD Ryzen embedded V1807B quad-core 45W CPU
• Integrated Vision Specific I/O
  • 4-CH CC/CV lighting controller
  • 4-CH camera trigger outputs
  • 1-CH quadrature encoder input
  • 8-CH isolated DI and 8-CH isolated DO
• Patented MCU-based, real time I/O control by DTIO V2 and NuMCU
• Built-in camera interfaces
  • Four Gigabit PoE+ ports with screw-lock
  • Four USB 3.1 ports with screw-lock
• M.2 2280 M key NVMe (Gen3x2) socket for fast storage access

• Compact 221 x 173 x 76 mm footprint
• Supports Intel^® 6th-Gen Core^™ i7/i5/i3 LGA 1151 socket CPU
• Rugged, -25°C to 70°C fanless operation
• 3x GbE and 4x USB 3.0 ports
• 2x RS-232/422/485 ports and 2x RS-232 ports
• VGA + DVI dual display outputs
• Accommodates one 3.5" HDD or 2.5" HDD/SSD
• Optional 8-CH isolated DI and 8-CH isolated DO

Main Features:

• Supports 6th-Gen Intel Core i7/i5/i3, Pentium and Cereron LGA1151 CPU
• Up to five expansion slots
• x16 PCIe and x8 PCIe slots
• Rugged, -25 C° to 60 C° fanless operation
• 2x GbE, 4x USB 3.0 and 5x COM ports
• Dual DVI display outputs
• Up to 3x 2.5" SATA accommodation and 1x mSATA socket
• Wall-mounting, DIN-rail mounting and rack-mounting available
• Automatic temperature sensing and fan control (optional)

Main Features:

• Supports 6th-Gen Intel Core i7/i5/i3, Pentium and Cereron LGA1151 CPU
• Up to five expansion slots
• x16 PCIe, x8 PCIe and three PCI slots
• Rugged, -25 C° to 60 C° fanless operation
• 2x GbE, 4x USB 3.0 and 5x COM ports
• Dual DVI display outputs
• Up to 3x 2.5" SATA accommodation and 1x mSATA socket
• Wall-mounting, DIN-rail mounting and rack-mounting available
• Automatic temperature sensing and fan control (optional)

Main Features

• Intel® 9th/ 8th-Gen Core™ i7/ i5/ i3, Pentium® and Celeron® LGA1151 CPU
• Supports NVIDIA® GPU up to 200W TDP
• An additional x4 PCIe, and a PCI slot for add-on cards
• -25°C to 60°C wide-temperature operation
• 2x GbE, 4x USB 3.1 Gen1 and 5x COM ports
• Dual DVI display outputs
• Up to 2x 2.5" SATA HDD/ SSD accommodation and 1x mSATA socket

Main Features:

• Supports Intel 12/13th-Gen 35W/65W CPUs
• Patented Cassette for PCI/PCIe add-on card accommodation
• Rugged, -25°C to 70°C fanless operation
• Up to 5x 2.5GbE and 1x GigE ports with optional PoE+, supporting 9.5 KB jumbo frame
• 1x USB 3.2 Gen2x2 type-C and 8x USB 3.2/ 2.0 type-A ports
• Supports M.2 Gen4x4 NVMe and 2x SATA ports
• MezIO™ interface for easy function expansion
• VGA/ DVI/ DP triple independent display, supporting 4K2K resolution

• 6x GMSL2 FAKRA Z inputs supporting automotive GMSL2 cameras
• Turnkey solution with pre-installed GMSL2 camera driver for selected cameras
• Powered by NVIDIA® Jetson Xavier™ NX bundled with JetPack 4.6.1
• 21 TOPS AI performance with up to 22 streams simultaneous 1080p@30FPS video encoding capability
• x2 Gen3 PCI Express interface offering 10Gb/s total bandwidth
• 1x GPS PPS input for frame sync calibration
• 1x isolated CAN 2.0 and 1x RS232
• -25°C to 60°C operating temperature with airflow

• AMD Ryzen™ embedded V1000 series quad-core 15W/ 45W CPU
• -25°C to 70°C rugged wide-temperature operation
• Four Gigabit PoE+ ports with screw-lock
• Four USB 3.0 ports with screw-lock
• M.2 2280 M key NVMe (Gen3 x2) socket for fast storage access
• DP + VGA dual display outputs
• Front I/O access and DIN-rail mounting design
• MezIO™ compatible

• AMD Ryzen™ embedded V1605B quad-core 15W CPU
• -40°C to 70°C rugged wide temperature fanless operation
• Four IEEE 802.3at PoE+ ports with screw-lock
• One isolated CAN bus port for in-vehicle communication
• One M.2 socket and three mPCIe sockets
• M.2 2280 M key NVMe (Gen3 x2) socket for fast storage access
• 4-CH isolated DI and 4-CH isolated DO
• 8~35V DC input with built-in ignition power control
• E-Mark and EN 50155/ EN 45545 certificate

• Intel Alder Lake Core i3-N305 processor 15W with 8 E-Cores or Atom x7425E
• Up to 16GB DDR5-4800 SODIMM
• -25 °C to 70 °C rugged wide temperature operation
• 4x GbE ports PoE+ / 4x USB3.2 Gen 2 with screw-lock
• M.2 2280 M key SATA socket
• DP++ / HDMI 1.4b dual display outputs
• 4-CH isolated DI + 4-CH isolated DO
• Front I/O access DIN-mounting design
• MezIO compatible
• UL certification (UL-US-2409582-0)
• Complies with UL 62368-1 standards

Main Features

• 11th gen Intel® Core™ i processor with 8 GB DDR4 memory
• Wide operating temperature range (-20 ~ 60 °C/-4 ~ 140 °F)
• 8 x DI, 8 x DO, and 4 x COM with isolation protection
• 1 x M.2 (M key) for 2280 NVMe SSD storage
• 1 x M.2 (B key) for 2242 storage and 3042/3052 cellular modules
• 1 x M.2 (E key) for 2230 Wi-Fi modules
• Supports Time-Sensitive Networking (TSN) technology
• Remote out-of-band (OOB) power management with Advantech’s iBMC technology
• Embedded TPM 2.0 for hardware-based security
• Modular design for optional iDoor extension
• Compliant with IEC 61010-2-201 safety requirements

Main Features