Industrial Computing

• Powered by NVIDIA Jetson AGX Xavier SOM bundled with JetPack 4.4
• 4x IEEE 802.3at Gigabit PoE+ ports with screw lock
• 2x front-accessible, hot swappable 2.5" HDD/SSD trays
• 1x mini-PCIe socket for WiFi/4G module
• 1x isolated CAN bus port and 1x RS-232 port with flow control
• 1x GPS PPS input, 3-CH isolated DI and 4-CH isolated DO
• 8~35V wide-range DC input with built-in ignition power control

Main Features

• Powered by NVIDA Jetson Xavier NX SOM bundled with JetPack 4.6
• Ruggesd -25-70C fanless operation
• 4x IEEE 802.3bt PoE++ GbE ports with screw-lock
• 2x mini-PCIe sockets for WiFi/GNSS/NVMe/CAN modules
• 1x 3042/3052 M.2 B key socket for 4G/5G mobile communication
• 1x hardware configurable RS232/422/485 port
• 8V-35V wide range DC imput with built-in ignition power control
• MIL-STD-810G and EN 50155 certified

Main Features:

• Supports an NVIDIA 350W GPU (Gen4 x16 PCIe)
• Dedicated GPU-locking bracket
• Intel 12th/13th-Gen Core™ 35W/ 65W LGA1700 CPU
• Up to 64GB ECC/ non-ECC DDR5 4800 with Intel R680E chipset (2x SODIMM)
• Three x8 PCIe slots (Gen3 x4) for add-on cards
• 6x USB 3.2, 2x 2.5GbE, 1x GbE, and 1x optional 10GbE
• Two front-accessible tray storage options: 1x 2.5" SATA and 1x optional NVMe
• 8V to 48V wide-range DC input with ignition power control
• -25°C to 60°C wide temperature operation

Main Features:

• Supports dual NVIDIA RTX series 350W GPUs with patent-pending locking mechanism
• Intel 12th/13th-Gen Core 35W/65W LGA1700 CPU
• Up to 64GB DDR5 4800 with Intel R680E PCH (2x SODIMM)
• Three x8, Gen3 PCIe slots (x4 signal) for add-on cards
• 2x 2.5GbE and 1x GbE and 1x optional 10GBASE-T Ethernet
• 1x internal M.2 NVMe, 2x 2.5" SATA trays and 1x optional NVMe tray
• Support 8 to 48V wide-range DC input with ignition power control
• Rugged, -25°C to 60°C operation

• AMD Ryzen™ embedded V1605B series quad-core 15W CPU
• Rugged -25°C to 70°C fanless operation
• 4x 4K DP display, 3840 x 2160 resolution per output
• AI inference capability by 2x optional Edge TPU
• 1x M.2 3042/3052 B-Key for 4G/5G module
• 2x USB3.1 Gen 1 and 2x USB2.0
• 8V to 35V wide-range DC input with built-in ignition power control
• Flexible power input options: mini-DIN or terminal block

Main Features:

• 212 x 165 x 63 mm low-profile design
• Intel 9th/8th Gen Core 35W LGA1151 CPU
• Rugged, -25C to 60C fanless operation
• 4x GbE and 4x USB 3.1Gen1 with screw lock
• 1 hot swappable HDD/SSD tray and 1x M.2 2280 socket for storage
• 4-CH isolated DI and 4-CH isolated DO
• DVI-I + DP dual display outputs
• Optional ignition power control

Main Features:

• Supports Intel 12/13th-Gen 35W/65W CPUs
• Patented Cassette for PCI/PCIe add-on card accommodation
• Rugged, -25°C to 70°C fanless operation
• Up to 5x 2.5GbE and 1x GigE ports with optional PoE+, supporting 9.5 KB jumbo frame
• 1x USB 3.2 Gen2x2 type-C and 8x USB 3.2/ 2.0 type-A ports
• Supports M.2 Gen4x4 NVMe and 2x SATA ports
• MezIO™ interface for easy function expansion
• VGA/ DVI/ DP triple independent display, supporting 4K2K resolution

• Intel Elkhart Lake Atom x6211E dual-core processor
• 49 x 89 x 112 mm extremely compact form factor
• Rugged -25°C to 70°C fanless wide-temperature operation
• Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
• M.2 2280 M key SATA storage interface
• One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
• One M.2 E key socket for WiFi 5/ WiFi 6 modules
• One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

Main Features