Industrial Computing

• Powered by NVIDIA Jetson AGX Xavier SOM bundled with JetPack 4.4
• 4x IEEE 802.3at Gigabit PoE+ ports with screw lock
• 2x front-accessible, hot swappable 2.5" HDD/SSD trays
• 1x mini-PCIe socket for WiFi/4G module
• 1x isolated CAN bus port and 1x RS-232 port with flow control
• 1x GPS PPS input, 3-CH isolated DI and 4-CH isolated DO
• 8~35V wide-range DC input with built-in ignition power control

• Powered by NVIDIA Jetson AGX Orin SoM bundled with JetPack 5.1.1
• Rugged -25°C to 70°C fanless operation (No throttling at 65°C with 64GB AGX Orin MAXN Mode)
• 2x 2.5 Gigabit Ethernet + 4x IEEE 802.3at Gigabit PoE+ ports
• 2x front-accessible 2.5” SSD trays
• 1x M.2 2280 M key socket for NVMe SSD
• 2x mini-PCIe sockets for WiFi/GNSS/NVMe/CAN modules
• 1x 3042/ 3052 M.2 B key socket for 4G/5G mobile communication
• 1x isolated RS-485 and 2x RS232 ports
• 8V to 48V wide-range DC input with built-in ignition power control

Main Features:

• Intel 6th Gen Core i7/i5 65W/35W CPU, up to 32 GB DDR4
• Integrated vision-specific I/O
  • 4-CH CC/CV lighting controller
  • 4-CH camera trigger outputs
  • 1-CH quadrature encoder input
  • 8-CH isolated DI and 8-CH isolated DO
• Patented MCU-based, real-time I/O control by DTIO V2 and NuMCU
• Built-in camera interfaces
  • 4-CH IEEE 802.3at Gigabit PoE+ ports
  • 4-CH USB 3.0 ports
• Supports nVidia GTX 950/1050 for GPU-accelerated MV

• Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/ 3.0GHz 12W processor
• Rugged -40°C to 70°C fanless operation, compliant with EN 50155 Class OT4
• 4x PoE+ GbE ports via M12 x-coded connectors
• 1x front-accessible 2.5” 15mm HDD tray and 1x M.2 2280 SATA SSD
• 1x M.2 3042/3052 B Key for 4G/5G mobile broadband
• 2x full-size mini-PCIe sockets for WIFI/CAN/GNSS modules
• 8-35V wide-range DC input with built-in ignition power control

Main Features:

• Supports Intel® 6th Gen Core™ i7/i5/i3 35W/65W LGA1151 CPU
• Patented Cassette for PCI/PCIe add-on card accommodation
• MezIO™ interface for easy function expansion
• Rugged, wide temperature range from -25°C to 70°C fanless operation
• Up to 6x GigE ports, supporting 9.5 KB jumbo frame
• Up to 32 GB, DDR4-2133 SODIMM
• Accommodates two 2.5" SATA HDD/SSD with RAID 0/1
• VGA/DVI/DP triple independent display, supporting 4K2K

Main Features:

• Intel® 6th Gen Core™ i7/i5/i3 LGA1151 35W/65W
• Dual PCIe x8 slots in patented expansion Cassette
• MezIO™ interface for easy function expansion
• Rugged, wide temperature range from -25°C to 70°C fanless operation
• 6x GbE ports, supporting 9.5 KB jumbo frame
• Up to 32 GB, DDR4-2133 SODIMM
• Accommodates two 2.5" SATA HDD/ SSD with RAID 0/1 support
• VGA/ DVI/ DP triple independent display, supporting 4K/2K resolution

Main Features:

• Patent-pending thermal design to allow -25°C to 60°C wide temperature system operation
• Includes 6th-Gen Intel Core i7 or i5 LGA1151 CPU
• 6x GigE ports, supporting 9.5 KB jumbo frame
• Up to 32 GB, DDR4-2133 SODIMM
• 240 mm x 225 mm x 111 mm compact footprint
• Compatible with MezIO interface for function expansion
• Accommodates two 2.5" SATA HDD/SSD with RAID 0/1 support

Main Features:

• Supports Intel 6th-Gen Core i7/i5/i3 LGA1151 CPU
• 4x 802.3at Gigabit PoE+ ports via M12 connectors
• On-board CAN bus for in-vehicle communication
• 4-CH isolated DI and 4-CH isolated DO
• 2x SATA ports for two 2.5" SATA HDD/SSD, with one hot-swappable HDD tray, supporting RAID 0/1
• 4x full-size mini-PCIe sockets with SIM support
• 8~35V wide-range DC input with built-in ignition control
• E-Mark and EN 50155 certificate

• Supports Intel® 6th-Gen Core™ i7/i5/i3 LGA1151 socket-type CPU
• 8x 802.3at PoE+ ports and 2x GbE ports
• 2x 3.5" HDD accommodation, support RAID 0/1 with over 24TB capacity
• Dedicated HDD heat-spreader for optimized thermal performance
• 4x full-size mini-PCIe sockets with SIM support
• 4-CH isolated DI and 4-CH isolated DO
• 1x CAN 2.0 port
• 8~35V wide-range DC input with built-in ignition power control
• Patented damping brackets to withstand 1Grms vibration

Main Features:

• Compact 255 x 173 x 76 mm footprint
• Intel® 9th/ 8th-Gen Core™ 35W LGA1151 CPU
• Rugged, -25°C to 60°C fanless operation
• 2x GbE and 4x USB3.0
• 2x RS-232/422/485 and 2x RS-232 ports
• VGA + DVI dual display outputs
• Supports 1x M.2 2280 SSD (SATA signal)
• Supports 1x 3.5" or 2.5" SATA HDD/ SSD

Main Features:

• 212 x 165 x 63 mm low-profile design
• Intel 9th/8th Gen Core 35W LGA1151 CPU
• Rugged, -25C to 60C fanless operation
• 4x GbE and 4x USB 3.1Gen1 with screw lock
• 1 hot swappable HDD/SSD tray and 1x M.2 2280 socket for storage
• 4-CH isolated DI and 4-CH isolated DO
• DVI-I + DP dual display outputs
• Optional ignition power control

Main Features:

• Supports Intel 12/13th-Gen 35W/65W CPUs
• Patented Cassette for PCI/PCIe add-on card accommodation
• Rugged, -25°C to 70°C fanless operation
• Up to 5x 2.5GbE and 1x GigE ports with optional PoE+, supporting 9.5 KB jumbo frame
• 1x USB 3.2 Gen2x2 type-C and 8x USB 3.2/ 2.0 type-A ports
• Supports M.2 Gen4x4 NVMe and 2x SATA ports
• MezIO™ interface for easy function expansion
• VGA/ DVI/ DP triple independent display, supporting 4K2K resolution

• Intel Elkhart Lake Atom x6211E dual-core processor
• 49 x 89 x 112 mm extremely compact form factor
• Rugged -25°C to 70°C fanless wide-temperature operation
• Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
• M.2 2280 M key SATA storage interface
• One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
• One M.2 E key socket for WiFi 5/ WiFi 6 modules
• One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

• Intel® Elkhart Lake Atom® x6425E quad-core 1.8GHz/ 3.0GHz 12W processor
• Rugged -25 °C to 70 °C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
• 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
• M.2 2280 M key SATA interface
• Dual DP display outputs supporting 4096 x 2160 resolution
• Front I/O access DIN-mounting design
• MezIO™ compatible

• Intel® Atom® x6425E quad-core processor
• Rugged -25°C to 70°C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port
• 1x M.2 2242/ 3052 B key for 4G/5G module
• 2x M.2 2230 E key for WIFI and edge TPU module
• Conduction-cooled heatsink for M.2/ mPCIe modules
• Dual M.2 2280 M key for SATA SSD
• 8~35V DC input with built-in ignition power control