Industrial Computing

Main Features

• Intel® 8th/9th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q370/H310 chipset
• Wide operating temperature (-10 ~ 50 °C)
• VGA and HDMI output
• 2 x GigaLAN, 2 x USB 3.1 and 6 x USB 3.0
• 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)
• 1 x 2.5" HDD/SSD, and 1 x mSATA
• 9 ~ 36 VDC input power range
• Supports FlexIO and iDoor technology, flexible configure additional HDMI, DVI, Comport, DIO, Remote switch IO
• Supports Advantech i-Modules
• Supports Advantech SUSIAPI and embedded software APIs

• Powered by NVIDIA Jetson AGX Orin SoM bundled with JetPack 5.1.1
• Rugged -25°C to 70°C fanless operation (No throttling at 65°C with 64GB AGX Orin MAXN Mode)
• 2x 2.5 Gigabit Ethernet + 4x IEEE 802.3at Gigabit PoE+ ports
• 2x front-accessible 2.5” SSD trays
• 1x M.2 2280 M key socket for NVMe SSD
• 2x mini-PCIe sockets for WiFi/GNSS/NVMe/CAN modules
• 1x 3042/ 3052 M.2 B key socket for 4G/5G mobile communication
• 1x isolated RS-485 and 2x RS232 ports
• 8V to 48V wide-range DC input with built-in ignition power control

Main Features

• Powered by NVIDA Jetson Xavier NX SOM bundled with JetPack 4.6
• Ruggesd -25-70C fanless operation
• 4x IEEE 802.3bt PoE++ GbE ports with screw-lock
• 2x mini-PCIe sockets for WiFi/GNSS/NVMe/CAN modules
• 1x 3042/3052 M.2 B key socket for 4G/5G mobile communication
• 1x hardware configurable RS232/422/485 port
• 8V-35V wide range DC imput with built-in ignition power control
• MIL-STD-810G and EN 50155 certified

Main Features:

• Intel 6th Gen Core i7/i5 65W/35W CPU, up to 32 GB DDR4
• Integrated vision-specific I/O
  • 4-CH CC/CV lighting controller
  • 4-CH camera trigger outputs
  • 1-CH quadrature encoder input
  • 8-CH isolated DI and 8-CH isolated DO
• Patented MCU-based, real-time I/O control by DTIO V2 and NuMCU
• Built-in camera interfaces
  • 4-CH IEEE 802.3at Gigabit PoE+ ports
  • 4-CH USB 3.0 ports
• Supports nVidia GTX 950/1050 for GPU-accelerated MV

• AMD Ryzen embedded V1807B quad-core 45W CPU
• Integrated Vision Specific I/O
  • 4-CH CC/CV lighting controller
  • 4-CH camera trigger outputs
  • 1-CH quadrature encoder input
  • 8-CH isolated DI and 8-CH isolated DO
• Patented MCU-based, real time I/O control by DTIO V2 and NuMCU
• Built-in camera interfaces
  • Four Gigabit PoE+ ports with screw-lock
  • Four USB 3.1 ports with screw-lock
• M.2 2280 M key NVMe (Gen3x2) socket for fast storage access

• Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/ 3.0GHz 12W processor
• Rugged -40°C to 70°C fanless operation, compliant with EN 50155 Class OT4
• 4x PoE+ GbE ports via M12 x-coded connectors
• 1x front-accessible 2.5” 15mm HDD tray and 1x M.2 2280 SATA SSD
• 1x M.2 3042/3052 B Key for 4G/5G mobile broadband
• 2x full-size mini-PCIe sockets for WIFI/CAN/GNSS modules
• 8-35V wide-range DC input with built-in ignition power control

• AMD Ryzen™ embedded V1605B series quad-core 15W CPU
• Rugged -25°C to 70°C fanless operation
• 4x 4K DP display, 3840 x 2160 resolution per output
• AI inference capability by 2x optional Edge TPU
• 1x M.2 3042/3052 B-Key for 4G/5G module
• 2x USB3.1 Gen 1 and 2x USB2.0
• 8V to 35V wide-range DC input with built-in ignition power control
• Flexible power input options: mini-DIN or terminal block

• Supports Intel® 9th / 8th Core™ i7/ i5/ i3 LGA1151 socket-type CPU
• 4x or 8x 802.3at Gigabit PoE+ ports via M12 or RJ45 connectors
• Onboard isolated CAN bus for in-vehicle communication
• 4-CH isolated DI and 4-CH isolated DO
• 2x hot-swappable SATA HDD trays, supporting RAID 0/1
• 2x M.2 B key and 3x full-size mini-PCIe sockets
• 8~35V wide-range DC input with built-in ignition power control
• Patented Cassette for PCIe add-on card accommodation*
• E-Mark and EN 50155 certificate

Main Features:

• Compact 255 x 173 x 76 mm footprint
• Intel® 9th/ 8th-Gen Core™ 35W LGA1151 CPU
• Rugged, -25°C to 60°C fanless operation
• 2x GbE and 4x USB3.0
• 2x RS-232/422/485 and 2x RS-232 ports
• VGA + DVI dual display outputs
• Supports 1x M.2 2280 SSD (SATA signal)
• Supports 1x 3.5" or 2.5" SATA HDD/ SSD

Main Features:

• Supports dual NVIDIA® Tesla T4 GPU
• Supports Intel® Xeon® E or 9th/ 8th-Gen Core™ i7/ i5 LGA1151 CPU
• Up to 128GB ECC/ non-ECC DDR4 2133 (4x SODIMM)
• Two x8 (4-lanes), Gen3 PCIe slots for add-on cards
• 1x M.2 M key, 1x M.2 B key and 2x full-size mini-PCIe sockets
• 8~48V wide-range DC input with built-in ignition power control
• Proven thermal design for -25°C to 60°C rugged operation*
• Patented damping brackets* to withstand 3 Grms vibration

• Intel Elkhart Lake Atom x6211E dual-core processor
• 49 x 89 x 112 mm extremely compact form factor
• Rugged -25°C to 70°C fanless wide-temperature operation
• Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
• M.2 2280 M key SATA storage interface
• One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
• One M.2 E key socket for WiFi 5/ WiFi 6 modules
• One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

• Intel® Atom® x6425E quad-core processor
• Rugged -25°C to 70°C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port
• 1x M.2 2242/ 3052 B key for 4G/5G module
• 2x M.2 2230 E key for WIFI and edge TPU module
• Conduction-cooled heatsink for M.2/ mPCIe modules
• Dual M.2 2280 M key for SATA SSD
• 8~35V DC input with built-in ignition power control