Industrial Computing

Main Features:

• Supports Intel  Xeon  / Core i7/i5/i3 processor with Q87/C226 chipset
• Four DIMM sockets support up to 32 GB DDR3 1333/1600 MHz SDRAM
• Supports CRT, DVI, LVDS, DP, eDP (optional) display
• Supports Intel AMT 9.0 and Intel vPro competent
• Supports PCIE Gen3, USB 3.0, Software RAID 0,1,5,10, TPM 1.2 (Optional)
• Support 6 x SATAIII, 2 SATAII and dual GbE LAN
• Supports SUSIAccess and Embedded Software APIs

Main Features

• Intel® 8th/9th generation Core™ i7/i5/i3 & Pentium®/Celeron® processor with Q370 chipset.
• Four DIMM sockets up to 64 GB DDR4 2400/2666
• Triple display VGA/DVI-D/DP and dual GbE LAN
• SATA RAID 0, 1, 5, 10, USB 3.1
• Supports Intel vPro, AMT & TPM technologies
• Note 1: TPM module is required to enable Intel vPro and TPM technologies.
• Note 2: Intel 8th generation processors only support Windows 10 (64-bit).

Main Features

• Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipset
• Four DIMM sockets up to 128 GB DDR4 2933
• Triple display DP/DVI-D/VGA and dual GbE LAN
• M.2, SATA RAID 0, 1, 5, 10, USB 3.2
• Supports Intel vPro, AMT & TPM technologie

Note 1: TPM module is required to enable Intel vPro and TPM technologies. Note 2: Legacy platform is not supported.

Main Features

• Supports LGA 1151 Intel® Xeon® & 8th Generation Core™ i7/i5/i3 processors
• DDR4 2666/2400/2133 MHz ECC/Non-ECC UDIMM up to 64 GB
• 1 Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCIe x1 slots
• Triple displays - DVI-D, VGA and HDMI 2.0 ports
• 8 SATA3 ports and four USB 3.1 ports
• 2 X RJ45 Ethernet Connectors
• Rackmount optimized placement with positive air flow design
• 0 ~ 60° C ambient operation temperature range

Main Features 

• LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset
• DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB
• One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots
• Triple displays - DVI-D, VGA, and HDMI 2.0 ports
• Five SATA 3 ports and four x USB 3.2 ports
• One M.2 2280/2242 (SATA / PCIe compatible)
• Rackmount optimized placement with positive air flow design
• 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range

Note: Supported OS including Windows 10 (64-bit) and Server 2019 (64-bit) have been validated.

Main Features:

• EATX Server Board with dual Xeon E5-2600(v2) processor, PME flexible expansion and 128GB memory capacity
• DDR3 1600MHz RDIMM up to 128GB
• Three PCIe x16 slot(Gen3.0) + one PCIe x8 slot(Gen3.0) slots and PME expansion slot
• 0~40 C ambient operation temperature range
• Note: ASMB-922 could enable PME slot when processor is installed in CPU0 socket.

• Fanless compact design
• NVIDIA Jetson Xavier NX embedded
• Supports 1x mPCIe and 1x M.2 (PCIex4 NVMe)
• 2x LAN ports
• Bundle with Linux 18.04
• Low power consumption
• Support PCIe add on card
• Supports 24/7 secure remote monitoring, control, and OTA deployment - powered by Allxon (support JetPack 4.4GA and above)

Main Features:

•   Intel® 6th Generation Core™ i7/i5/i3 BGA type CPU with Intel QM170 PCH
•   I-Module expansion module
•   VGA & DVI Interface
•   1 x 2.5" HDD/ 1 x CFast slot/ 1 x mSATA storage options
•   2 Giga LAN and 8x USB 3.0
•   2 x RS-232/422/485 & 2 x RS232 Serial ports
•   Isolation COM module & 32bit GPIO module
•   Supports wide power range of 9 ~ 36V DC input
•   Supports wide range operating Temperature of -20° ~ 60° C
•   Supports SUSIAccess and Embedded Software APIs

Main Features

• Intel® 8th/9th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q370/H310 chipset
• Wide operating temperature (-10 ~ 50 °C)
• VGA and HDMI output
• 2 x GigaLAN, 2 x USB 3.1 and 6 x USB 3.0
• 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)
• 1 x 2.5" HDD/SSD, and 1 x mSATA
• 9 ~ 36 VDC input power range
• Supports FlexIO and iDoor technology, flexible configure additional HDMI, DVI, Comport, DIO, Remote switch IO
• Supports Advantech i-Modules
• Supports Advantech SUSIAPI and embedded software APIs

• Intel® 6th/7th Generation Core™ i Desktop CPU (LGA1151) with Q170/H110 chipset
• 2 x RS-232/422/485 and 4 x RS232 serial ports (with expansion cable)
• 1 x 2.5" HDD, 1 x CFast, 1x mSATA and 1 mini-PCIe with SIM
• Supports 2 LAN, Isolation COM, 32-bit GPIO modules
• 2 x GigaLAN and 8 x USB 3.0
• VGA and DVI output
• Supports Advantech's i-module, SUSIAccess, and embedded software APIs
• 9V_DC ~ 36V_DC input power range
• Wide operating temperature

Main Features:

• Intel® Xeon® D-1539/D-1559 SoC processor
• Wide operating temperature (-20 ~ 50 °C)
• 9 ~ 36 VDC input power range
• 2 x RS-232/422/485 and 2 x RS232 serial ports (with expansion cable)
• 1 x 2.5" HDD/SSD, 1 x CFast, 1 x M.2
• 4 x GigaLAN and 4 x USB 3.0
• Supports Advantech i-Modules, SUSIAccess, and embedded software APIs
• Supports Windows Server 2016, Linux OS, and VMware

• Powered by NVIDIA Jetson AGX Xavier SOM bundled with JetPack 4.4
• Support 8x GMSL automotive cameras via FAKRA Z connectors
• 1x 10 GBASE-T 10G Ethernet port
• 1x M.2 2280 M key socket for NVMe SSD
• 1x miniPCIe socket for WiFi/4G module
• 1x Isolated CAN bus port and 1x RS-232 port with flow control
• 1x GPS PPS input, 3-CH isolated DI and 4-CH isolated DO
• 8V to 35V wide-range DC imnput with built-in ignition power control

• Powered by NVIDIA Jetson AGX Xavier SOM bundled with JetPack 4.4
• 4x IEEE 802.3at Gigabit PoE+ ports with screw lock
• 2x front-accessible, hot swappable 2.5" HDD/SSD trays
• 1x mini-PCIe socket for WiFi/4G module
• 1x isolated CAN bus port and 1x RS-232 port with flow control
• 1x GPS PPS input, 3-CH isolated DI and 4-CH isolated DO
• 8~35V wide-range DC input with built-in ignition power control

• Powered by NVIDIA Jetson AGX Orin SoM bundled with JetPack 5.1.1
• Rugged -25°C to 70°C fanless operation (No throttling at 65°C with 64GB AGX Orin MAXN Mode)
• 2x 2.5 Gigabit Ethernet + 4x IEEE 802.3at Gigabit PoE+ ports
• 2x front-accessible 2.5” SSD trays
• 1x M.2 2280 M key socket for NVMe SSD
• 2x mini-PCIe sockets for WiFi/GNSS/NVMe/CAN modules
• 1x 3042/ 3052 M.2 B key socket for 4G/5G mobile communication
• 1x isolated RS-485 and 2x RS232 ports
• 8V to 48V wide-range DC input with built-in ignition power control

Main Features:

• Intel 6th Gen Core i7/i5 65W/35W CPU, up to 32 GB DDR4
• Integrated vision-specific I/O
  • 4-CH CC/CV lighting controller
  • 4-CH camera trigger outputs
  • 1-CH quadrature encoder input
  • 8-CH isolated DI and 8-CH isolated DO
• Patented MCU-based, real-time I/O control by DTIO V2 and NuMCU
• Built-in camera interfaces
  • 4-CH IEEE 802.3at Gigabit PoE+ ports
  • 4-CH USB 3.0 ports
• Supports nVidia GTX 950/1050 for GPU-accelerated MV

• Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/ 3.0GHz 12W processor
• Rugged -40°C to 70°C fanless operation, compliant with EN 50155 Class OT4
• 4x PoE+ GbE ports via M12 x-coded connectors
• 1x front-accessible 2.5” 15mm HDD tray and 1x M.2 2280 SATA SSD
• 1x M.2 3042/3052 B Key for 4G/5G mobile broadband
• 2x full-size mini-PCIe sockets for WIFI/CAN/GNSS modules
• 8-35V wide-range DC input with built-in ignition power control

Main Features:

• Supports Intel® 6th Gen Core™ i7/i5/i3 35W/65W LGA1151 CPU
• Patented Cassette for PCI/PCIe add-on card accommodation
• MezIO™ interface for easy function expansion
• Rugged, wide temperature range from -25°C to 70°C fanless operation
• Up to 6x GigE ports, supporting 9.5 KB jumbo frame
• Up to 32 GB, DDR4-2133 SODIMM
• Accommodates two 2.5" SATA HDD/SSD with RAID 0/1
• VGA/DVI/DP triple independent display, supporting 4K2K

Main Features:

• Intel® 6th Gen Core™ i7/i5/i3 LGA1151 35W/65W
• Dual PCIe x8 slots in patented expansion Cassette
• MezIO™ interface for easy function expansion
• Rugged, wide temperature range from -25°C to 70°C fanless operation
• 6x GbE ports, supporting 9.5 KB jumbo frame
• Up to 32 GB, DDR4-2133 SODIMM
• Accommodates two 2.5" SATA HDD/ SSD with RAID 0/1 support
• VGA/ DVI/ DP triple independent display, supporting 4K/2K resolution

Main Features:

• Patent-pending thermal design to allow -25°C to 60°C wide temperature system operation
• Includes 6th-Gen Intel Core i7 or i5 LGA1151 CPU
• 6x GigE ports, supporting 9.5 KB jumbo frame
• Up to 32 GB, DDR4-2133 SODIMM
• 240 mm x 225 mm x 111 mm compact footprint
• Compatible with MezIO interface for function expansion
• Accommodates two 2.5" SATA HDD/SSD with RAID 0/1 support

Main Features:

• Supports Intel 6th-Gen Core i7/i5/i3 LGA1151 CPU
• 4x 802.3at Gigabit PoE+ ports via M12 connectors
• On-board CAN bus for in-vehicle communication
• 4-CH isolated DI and 4-CH isolated DO
• 2x SATA ports for two 2.5" SATA HDD/SSD, with one hot-swappable HDD tray, supporting RAID 0/1
• 4x full-size mini-PCIe sockets with SIM support
• 8~35V wide-range DC input with built-in ignition control
• E-Mark and EN 50155 certificate

• Supports Intel® 6th-Gen Core™ i7/i5/i3 LGA1151 socket-type CPU
• 8x 802.3at PoE+ ports and 2x GbE ports
• 2x 3.5" HDD accommodation, support RAID 0/1 with over 24TB capacity
• Dedicated HDD heat-spreader for optimized thermal performance
• 4x full-size mini-PCIe sockets with SIM support
• 4-CH isolated DI and 4-CH isolated DO
• 1x CAN 2.0 port
• 8~35V wide-range DC input with built-in ignition power control
• Patented damping brackets to withstand 1Grms vibration

Main Features:

• Compact 255 x 173 x 76 mm footprint
• Intel® 9th/ 8th-Gen Core™ 35W LGA1151 CPU
• Rugged, -25°C to 60°C fanless operation
• 2x GbE and 4x USB3.0
• 2x RS-232/422/485 and 2x RS-232 ports
• VGA + DVI dual display outputs
• Supports 1x M.2 2280 SSD (SATA signal)
• Supports 1x 3.5" or 2.5" SATA HDD/ SSD

Main Features:

• 212 x 165 x 63 mm low-profile design
• Intel 9th/8th Gen Core 35W LGA1151 CPU
• Rugged, -25C to 60C fanless operation
• 4x GbE and 4x USB 3.1Gen1 with screw lock
• 1 hot swappable HDD/SSD tray and 1x M.2 2280 socket for storage
• 4-CH isolated DI and 4-CH isolated DO
• DVI-I + DP dual display outputs
• Optional ignition power control

Main Features

• Intel® 9th/ 8th-Gen Core™ i7/ i5/ i3, Pentium® and Celeron® LGA1151 CPU
• Supports NVIDIA® GPU up to 200W TDP
• An additional x4 PCIe, and a PCI slot for add-on cards
• -25°C to 60°C wide-temperature operation
• 2x GbE, 4x USB 3.1 Gen1 and 5x COM ports
• Dual DVI display outputs
• Up to 2x 2.5" SATA HDD/ SSD accommodation and 1x mSATA socket

Main Features:

• Supports Intel 12/13th-Gen 35W/65W CPUs
• Patented Cassette for PCI/PCIe add-on card accommodation
• Rugged, -25°C to 70°C fanless operation
• Up to 5x 2.5GbE and 1x GigE ports with optional PoE+, supporting 9.5 KB jumbo frame
• 1x USB 3.2 Gen2x2 type-C and 8x USB 3.2/ 2.0 type-A ports
• Supports M.2 Gen4x4 NVMe and 2x SATA ports
• MezIO™ interface for easy function expansion
• VGA/ DVI/ DP triple independent display, supporting 4K2K resolution

Main Features:

• Supports Intel Xeon E3-1200v5 series, Core i7/i5/i3 LGA1151 processors with C236
• Dual Channel (ECC/Non-ECC) DDR4 2133/1600 up to 16 GB
• Supports PCIE 3.0, M.2, USB 3.0, SATA3.0, SW Raid 0, 1, 5, 10
• Supports CRT and 2 x DVI-D/DP(cable optional) display
• Supports out-of-band remote management with AMT10 and IPMI
• Supports Advantech LPC modules
• Supports SUSIAccess and Embedded Software APIs

• Intel Elkhart Lake Atom x6211E dual-core processor
• 49 x 89 x 112 mm extremely compact form factor
• Rugged -25°C to 70°C fanless wide-temperature operation
• Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
• M.2 2280 M key SATA storage interface
• One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
• One M.2 E key socket for WiFi 5/ WiFi 6 modules
• One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

• Intel® Elkhart Lake Atom® x6425E quad-core 1.8GHz/ 3.0GHz 12W processor
• Rugged -25 °C to 70 °C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
• 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
• M.2 2280 M key SATA interface
• Dual DP display outputs supporting 4096 x 2160 resolution
• Front I/O access DIN-mounting design
• MezIO™ compatible

• Intel® Atom® x6425E quad-core processor
• Rugged -25°C to 70°C fanless operation
• 2x 2.5GbE PoE+ ports and 1x 2.5GbE port
• 1x M.2 2242/ 3052 B key for 4G/5G module
• 2x M.2 2230 E key for WIFI and edge TPU module
• Conduction-cooled heatsink for M.2/ mPCIe modules
• Dual M.2 2280 M key for SATA SSD
• 8~35V DC input with built-in ignition power control

Main Features

• 11th gen Intel® Core™ i processor with 8 GB DDR4 memory
• Wide operating temperature range (-20 ~ 60 °C/-4 ~ 140 °F)
• 8 x DI, 8 x DO, and 4 x COM with isolation protection
• 1 x M.2 (M key) for 2280 NVMe SSD storage
• 1 x M.2 (B key) for 2242 storage and 3042/3052 cellular modules
• 1 x M.2 (E key) for 2230 Wi-Fi modules
• Supports Time-Sensitive Networking (TSN) technology
• Remote out-of-band (OOB) power management with Advantech’s iBMC technology
• Embedded TPM 2.0 for hardware-based security
• Modular design for optional iDoor extension
• Compliant with IEC 61010-2-201 safety requirements

Main Features